Patents by Inventor Ryo KAMODA

Ryo KAMODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11791234
    Abstract: A semiconductor device includes a substrate that has a first surface and a second surface on which a plurality of solder balls are provided, a semiconductor memory on the first surface of the substrate, a controller arranged on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory, a graphite sheet extending along the first direction above the controller and the semiconductor memory, and a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: October 17, 2023
    Assignee: Kioxia Corporation
    Inventors: Ryo Kamoda, Hideki Takahashi
  • Publication number: 20220102239
    Abstract: A semiconductor device includes a substrate that has a first surface and a second surface on which a plurality of solder balls are provided, a semiconductor memory on the first surface of the substrate, a controller arranged on the first surface of the substrate, separated from the semiconductor memory along a first direction, and configured to control the semiconductor memory, a graphite sheet extending along the first direction above the controller and the semiconductor memory, and a first sealing material that seals the semiconductor memory, the controller, and the graphite sheet.
    Type: Application
    Filed: March 3, 2021
    Publication date: March 31, 2022
    Inventors: Ryo KAMODA, Hideki TAKAHASHI