Patents by Inventor Ryo Mori
Ryo Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963485Abstract: A natural invasion promoting method that is environmentally friendly, easy to carry out, can cope with a wide range of areas and inclined surfaces, achieves efficient natural invasion, and can satisfactorily promote greening on a soil surface of interest, and a spraying material used in the method are provided. A natural invasion promoting method including: spraying a spraying material containing live algae on a soil surface; breeding the live algae; and also directly or indirectly catching flying seeds or spores by a tacky substance secreted on surfaces of the live algae or a catching structure composed of the live algae to promote greening on the soil surface.Type: GrantFiled: August 14, 2019Date of Patent: April 23, 2024Assignees: NIPPON KOEI CO., LTD., NIKKEN SOHONSHA CORPORATIONInventors: Mineto Tomisaka, Masaru Onodera, Fumiko Iwaki, Hisako Sanada, Taketo Nakano, Nobuo Mori, Ryo Sumi, Kanya Tokunaga
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Patent number: 11952002Abstract: A control device includes: an acquisition unit configured to acquire, from a driving assist system, a requested acceleration and ending information indicating an end of a deceleration control; and a control unit configured to control a powertrain and a brake based on the requested acceleration, and perform a prescribed process of stabilizing a driving force and a braking force that are generated in an ending process of the deceleration control based on the requested acceleration when the acquisition unit acquires the ending information.Type: GrantFiled: June 8, 2022Date of Patent: April 9, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akitsugu Sakai, Ryo Sumikura, Taisuke Hayashi, Yuma Mori, Jun Aoki
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Publication number: 20240113433Abstract: An antenna module including a dielectric substrate having a long side and a short side, a ground electrode, a radiating element, a peripheral electrode, and a parasitic element. The radiating element is disposed to face the ground electrode. The peripheral electrode is disposed along the long side of the dielectric substrate and is electrically connected to the ground electrode. The parasitic element is disposed along the short side of the dielectric substrate and is disposed away from the radiating element. The radiating element is configured to emit radio waves in two polarization directions along the long side and the short side of the dielectric substrate. The shortest distance between the radiating element and the parasitic element is greater than the shortest distance between the radiating element and the peripheral electrode.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Kengo ONAKA, Ryo KOMURA, Hirotsugu MORI
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Publication number: 20240109869Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.Type: ApplicationFiled: January 25, 2022Publication date: April 4, 2024Inventors: Takeshi ENDO, Yasuyuki MORI, Ippei OKANO, Ryo OGAWA, Junji UEYAMA
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Publication number: 20240070539Abstract: A learning device includes an acquisition unit that acquires a local model corresponding to a feature value held by the own device, a residual calculation unit that calculates a difference between an output of a vertical federated learning model having been learned previously and an output of the local model acquired by the acquisition unit, and an additional tree learning unit that learns an additional tree to be added to the local model acquired by the acquisition unit, on the basis of the result of calculation by the residual calculation unit and the feature value held by the own device.Type: ApplicationFiled: August 23, 2023Publication date: February 29, 2024Applicant: NEC CorporationInventors: Junki Mori, Isamu Teranishi, Ryo Furukawa
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Patent number: 11675404Abstract: A semiconductor device includes: a plurality of cores configured to receive power from a power supply; a plurality of power switch circuits provided for each core and configured to control the power supplied to the corresponding cores; a compare circuit configured to receive power from the power supply and compare output data of the plurality of cores; and a core voltage monitor circuit configured to monitor a voltage of a node that connects the power supply and the compare circuit.Type: GrantFiled: May 13, 2021Date of Patent: June 13, 2023Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Ryo Mori, Kazuki Fukuoka, Kenichi Shimada
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Publication number: 20210365093Abstract: A semiconductor device includes: a plurality of cores configured to receive power from a power supply; a plurality of power switch circuits provided for each core and configured to control the power supplied to the corresponding cores; a compare circuit configured to receive power from the power supply and compare output data of the plurality of cores; and a core voltage monitor circuit configured to monitor a voltage of a node that connects the power supply and the compare circuit.Type: ApplicationFiled: May 13, 2021Publication date: November 25, 2021Inventors: Ryo MORI, Kazuki FUKUOKA, Kenichi SHIMADA
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Patent number: 10782763Abstract: A semiconductor device includes a voltage sensor which samples a power supply voltage at a speed faster than fluctuations in the power supply voltage and encodes the power supply voltage into a voltage code value. A voltage drop determination circuit detects a voltage drop based on the voltage code value, and a clock control circuit generates a clock. The clock control circuit stops the clock when the voltage drop determination circuit detects the voltage drop. The voltage drop determination circuit includes a prediction computation circuit which looks ahead a voltage value from a history of the voltage code value and predicts a variation value, and the prediction computation circuit includes a circuit for masking a prediction value if a differential value of the prediction value is continuously negative for a predetermined cycle.Type: GrantFiled: December 13, 2018Date of Patent: September 22, 2020Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuko Kitaji, Kazuki Fukuoka, Ryo Mori, Toshifumi Uemura
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Publication number: 20200286583Abstract: A position identification unit (110) maps a plurality of tumor sample reads to a human genome sequence, and identifies, for each target gene, a target position which is a genome position of a base, the genome position having changed with respect to the human genome sequence. A frequency calculation unit (120) calculates a variant allele frequency for each target position of each target gene. A distance calculation unit (130) calculates, for each target gene, a feature distance equivalent to a difference between a variant allele frequency corresponding to a peak density and a reference variant allele frequency in a density distribution indicating a density of the number of mapping reads with respect to the variant allele frequency. A coefficient calculation unit (140) calculates a correction coefficient using the feature distance of each target gene.Type: ApplicationFiled: September 10, 2018Publication date: September 10, 2020Applicants: Mitsubishi Space Software Co., Ltd., NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITYInventors: Shigeki TANISHIMA, Ryo MORI, Keisuke SAKAYORI, Hiroshi NISHIHARA, Sayaka YUZAWA
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Publication number: 20190129488Abstract: A semiconductor device includes a voltage sensor which samples a power supply voltage at a speed faster than fluctuations in the power supply voltage and encodes the power supply voltage into a voltage code value. A voltage drop determination circuit detects a voltage drop based on the voltage code value, and a clock control circuit generates a clock. The clock control circuit stops the clock when the voltage drop determination circuit detects the voltage drop. The voltage drop determination circuit includes a prediction computation circuit which looks ahead a voltage value from a history of the voltage code value and predicts a variation value, and the prediction computation circuit includes a circuit for masking a prediction value if a differential value of the prediction value is continuously negative for a predetermined cycle.Type: ApplicationFiled: December 13, 2018Publication date: May 2, 2019Inventors: Yuko Kitaji, Kazuki Fukuoka, Ryo Mori, Toshifumi Uemura
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Patent number: 10222847Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.Type: GrantFiled: July 29, 2016Date of Patent: March 5, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuko Kitaji, Kazuki Fukuoka, Ryo Mori, Toshifumi Uemura
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Patent number: 10199085Abstract: A semiconductor device capable of controlling a memory while preventing the functional deterioration of the memory and reducing the power consumption of the semiconductor device is provided. The semiconductor device includes a first semiconductor chip (logic chip) and a second semiconductor chip (memory chip). The first semiconductor chip includes a plurality of temperature sensors disposed in mutually different places, and a memory controller that controls each of a plurality of memory areas provided in the second semiconductor chip based on output results of a respective one of the plurality of temperature sensors.Type: GrantFiled: August 4, 2015Date of Patent: February 5, 2019Assignee: Renesas Electronics CorporationInventors: Takao Nomura, Ryo Mori, Kazuki Fukuoka
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Patent number: 10180711Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.Type: GrantFiled: July 29, 2016Date of Patent: January 15, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yuko Kitaji, Kazuki Fukuoka, Ryo Mori, Toshifumi Uemura
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Publication number: 20170075404Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.Type: ApplicationFiled: July 29, 2016Publication date: March 16, 2017Inventors: Yuko KITAJI, Kazuki FUKUOKA, Ryo MORI, Toshifumi UEMURA
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Publication number: 20160064063Abstract: A semiconductor device capable of controlling a memory while preventing the functional deterioration of the memory and reducing the power consumption of the semiconductor device is provided. The semiconductor device includes a first semiconductor chip (logic chip) and a second semiconductor chip (memory chip). The first semiconductor chip includes a plurality of temperature sensors disposed in mutually different places, and a memory controller that controls each of a plurality of memory areas provided in the second semiconductor chip based on output results of a respective one of the plurality of temperature sensors.Type: ApplicationFiled: August 4, 2015Publication date: March 3, 2016Applicant: Renesas Electronics CorporationInventors: Takao NOMURA, Ryo MORI, Kazuki FUKUOKA
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Publication number: 20160027731Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.Type: ApplicationFiled: October 5, 2015Publication date: January 28, 2016Inventors: Ryo Mori, Kazuki Fukuoka, Naozumi Morino, Yoshinori Deguchi
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Patent number: 9171767Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.Type: GrantFiled: November 8, 2014Date of Patent: October 27, 2015Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Ryo Mori, Kazuki Fukuoka, Naozumi Morino, Yoshinori Deguchi
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Publication number: 20150076709Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.Type: ApplicationFiled: November 8, 2014Publication date: March 19, 2015Inventors: Ryo Mori, Kazuki Fukuoka, Naozumi Morino, Yoshinori Deguchi
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Patent number: 8896129Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.Type: GrantFiled: February 15, 2013Date of Patent: November 25, 2014Assignee: Renesas Electronics CorporationInventors: Ryo Mori, Kazuki Fukuoka, Naozumi Morino, Yoshinori Deguchi
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Patent number: 8730703Abstract: Efficient reduction in power consumption is achieved by combinational implementation of a power cutoff circuit technique using power supply switch control and a DVFS technique for low power consumption. A power supply switch section fed with power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in a DEEP-NWELL region formed over a semiconductor substrate. Another power supply switch section fed with another power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in another DEEP-NWELL region formed over the semiconductor substrate. In this arrangement, there arises no possibility of short-circuiting between different power supplies via each DEEP-NWELL region formed over the semiconductor substrate.Type: GrantFiled: January 24, 2013Date of Patent: May 20, 2014Assignee: Renesas Electronics CorporationInventors: Kazuki Fukuoka, Yasuto Igarashi, Ryo Mori, Yoshihiko Yasu, Toshio Sasaki