Abstract: There is provided a mounting structure for an apparatus for taking out a molded product, the mounting structure being configured to reduce a burden imposed on a worker required to mount the apparatus for taking out a molded product. Upright wall portions of a pair of side plates are formed with a work window. Extended wall portions are formed with a work assist window. The work window is formed to have a size that allows a worker, who is at a location at which the worker can insert bolts into three through holes in a first through hole row, to insert bolts into three through holes in a second through hole row without changing the worker's location.

Abstract: An apparatus for taking out a molded product, includes: a transverse frame disposed above a resin injection molding machine to extend in a transverse direction, which is orthogonal to a longitudinal direction; an orthogonal frame supported by the transverse frame so as to be movable at least in the transverse direction; a vertical arm provided at the orthogonal frame so as to be movable up and down at least in the vertical direction; and a holding member provided at a distal end portion of the vertical arm to hold a resin molded product formed by the resin injection molding machine. The vertical arm is disposed so as to be inclined such that the axis line of an elevating shaft of the vertical arm forms an acute angle with respect to a perpendicular extending in the vertical direction.

Abstract: There is provided a mounting structure for an apparatus for taking out a molded product, the mounting structure being configured to reduce a burden imposed on a worker required to mount the apparatus for taking out a molded product. Upright wall portions of a pair of side plates are formed with a work window. Extended wall portions are formed with a work assist window. The work window is formed to have a size that allows a worker, who is at a location at which the worker can insert bolts into three through holes in a first through hole row, to insert bolts into three through holes in a second through hole row without changing the worker's location.

Abstract: An apparatus for taking out a molded product, which is capable of taking out a resin molded product in fewer steps than ever, includes: a transverse frame disposed above a resin injection molding machine to extend in a transverse direction which is orthogonal to a longitudinal direction; an orthogonal frame supported by the transverse frame so as to be movable at least in the transverse direction; a vertical arm provided at the orthogonal frame so as to be movable up and down at least in the vertical direction; and a holding member provided at a distal end portion of the vertical arm to hold a resin molded product formed by the resin injection molding machine. The vertical arm is disposed so as to be inclined such that the axis line of an elevating shaft of the vertical arm forms an acute angle with respect to a perpendicular extending in the vertical direction.

Abstract: An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion.

Abstract: An ultrasonic transducer fabrication method including: depositing a conductive material on an insulating layer, partially etching the conductive material to form lower electrodes; depositing an insulating material to cover the lower electrodes to form a first insulating layer and depositing a sacrificial material thereon, performing etching, to create cavities and a channel-shaped sacrificial layer to communicate the cavities; depositing an insulating material on the first insulating layer to form a second insulating layer; partially etching the second insulating layer to form holes; etching and removing the sacrificial layer through the holes to form the cavities and channels; depositing a conductive material on the second insulating layer to plug the holes and form a conductive film; partially etching the conductive film to form upper electrodes and sealing portions which plug the holes; and forming a protective film on the second insulating layer to cover the upper electrodes and the sealing portions.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) device, comprising: a cMUT formed on a semiconductor substrate; a DC high-voltage generation unit that is provided on the semiconductor substrate and that is for generating a DC high-voltage signal to be superposed on a driving signal for the cMUT; a driving signal generation unit that is provided on the semiconductor substrate and that is for generating the driving signal; and a superposition unit that is provided on the semiconductor substrate and that is for branching the DC high-voltage signal output from the DC high-voltage generation unit and for superposing one of the branched DC high-voltage signals on the other of the branched DC high-voltage signals via the driving signal generation unit.

Abstract: An ultrasonic transducer according to the present invention includes: two or more ultrasonic transducer cells, each of which has a lower electrode, a first insulating layer placed on the lower electrode, a cavity placed on the first insulating layer, a second insulating layer placed on the cavity, and an upper electrode placed above the second insulating layer; channels which communicate the cavities with each other; the second insulating layer placed on the channels; holes formed in the second insulating layer placed on the channels; and sealing portions which seal the holes, where that part of the sealing portions which enters the channels is the same in cross-sectional shape as the holes.

Abstract: An ultrasonic transducer cell according to the present invention includes: a substrate; a charge holding portion provided on the substrate; a lower electrode provided on the charge holding portion and used to input and output a signal; and a vibration membrane provided above the lower electrode to be separated from the lower electrode with a cavity, and configured to include at least an insulating film and an upper electrode provided on the insulating film.

Abstract: An ultrasonic transducer according to the present invention includes: two or more ultrasonic transducer cells, each of which has a lower electrode, a first insulating layer placed on the lower electrode, a cavity placed on the first insulating layer, a second insulating layer placed on the cavity, and an upper electrode placed above the second insulating layer; channels which communicate the cavities with each other; the second insulating layer placed on the channels; holes formed in the second insulating layer placed on the channels; and sealing portions which seal the holes, where that part of the sealing portions which enters the channels is the same in cross-sectional shape as the holes.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) device, comprising: a cMUT formed on a semiconductor substrate; a DC high-voltage generation unit that is provided on the semiconductor substrate and that is for generating a DC high-voltage signal to be superposed on a driving signal for the cMUT; a driving signal generation unit that is provided on the semiconductor substrate and that is for generating the driving signal; and a superposition unit that is provided on the semiconductor substrate and that is for branching the DC high-voltage signal output from the DC high-voltage generation unit and for superposing one of the branched DC high-voltage signals on the other of the branched DC high-voltage signals via the driving signal generation unit.

Abstract: An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion.

Abstract: An ultrasonic transducer cell according to the present invention includes: a substrate; a charge holding portion provided on the substrate; a lower electrode provided on the charge holding portion and used to input and output a signal; and a vibration membrane provided above the lower electrode to be separated from the lower electrode with a cavity, and configured to include at least an insulating film and an upper electrode provided on the insulating film.

Abstract: An ultrasonic transducer according to the present invention includes: two or more ultrasonic transducer cells, each of which has a lower electrode, a first insulating layer placed on the lower electrode, a cavity placed on the first insulating layer, a second insulating layer placed on the cavity, and an upper electrode placed above the second insulating layer; channels which communicate the cavities with each other; the second insulating layer placed on the channels; holes formed in the second insulating layer placed on the channels; and sealing portions which seal the holes, where that part of the sealing portions which enters the channels is the same in cross-sectional shape as the holes.

Abstract: An ultrasonic transducer of a capacitance type includes a pair of electrodes disposed to be opposed to each other and a vibration film including one of the pair of electrodes. The ultrasonic transducer includes n (n is a natural number equal to or larger than 1) air gap layers interposed between the pair of electrodes and m (m is a natural number equal to or larger than 1) insulating layers interposed between the pair of electrodes. In the ultrasonic transducer, a following Formula (1) is satisfied: d1?{?dn+?(tm/Km)}/3 ??(1) where, dn indicates a thickness of an nth air gap layer, d1 indicates a thickness of an air gap layer for allowing the vibration film to vibrate, tm indicates a thickness of an mth insulating layer, and Km indicates a dielectric constant of the mth insulating layer.

Abstract: A cantilever for a scanning probe microscope comprises a lever section and a probe section disposed near the free end thereof. The probe section includes a conical distal end portion having a narrow point angle and a bulging proximal end portion continuous with the distal end portion. The cantilever is manufactured by utilizing a semiconductor process.