Abstract: A notched wafer aligning apparatus capable of aligning a number of notched wafers received in a cassette with each other at a predetermined position and facilitating shifting of the thus-aligned wafers to any desired position. A plurality of notch detection rollers are rotatably arranged in juxtaposition to each other on a rotation drive shaft so as to be rotated while being abutted against a lower portion of peripheral edges of the wafers through a lower open end of the cassette. The notch detection rollers are individually rotated due to friction between the notch detection rollers and the rotation drive shaft.