Patents by Inventor Ryo Okura
Ryo Okura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11282623Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.Type: GrantFiled: July 13, 2018Date of Patent: March 22, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryo Okura, Yoichi Nakatsuji, Kosuke Ishida
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Patent number: 11227715Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.Type: GrantFiled: October 14, 2016Date of Patent: January 18, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Akinori Hamada, Hayami Kudo, Ryo Okura, Shinji Otani
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Patent number: 11189416Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.Type: GrantFiled: May 17, 2018Date of Patent: November 30, 2021Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoichi Nakatsuji, Kosuke Ishida, Ryo Okura
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Patent number: 10832855Abstract: An electronic component comprising an element body including opposite first and second end surfaces, and an upper surface connecting the first and second end surfaces; a circuit element embedded in the element body; a first lead-out electrode embedded on the first end surface side and electrically connected to the circuit element; a columnar electrode arranged separately from the first lead-out electrode in a first direction viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface; and a first via conductor connecting the first lead-out and columnar electrodes. An exposure width of the first via conductor, on the first end surface along a second direction orthogonal to the first direction viewed in the direction orthogonal to the first end surface, is smaller than the exposure width of the columnar electrode.Type: GrantFiled: April 11, 2018Date of Patent: November 10, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryo Okura, Hayami Kudo, Akinori Hamada
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Patent number: 10748698Abstract: An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.Type: GrantFiled: August 10, 2017Date of Patent: August 18, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryo Okura, Mizuho Katsuta, Kosuke Ishida
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Patent number: 10263590Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.Type: GrantFiled: January 9, 2017Date of Patent: April 16, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryo Okura, Hayami Kudo, Kenji Nishiyama
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Publication number: 20190035527Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.Type: ApplicationFiled: July 13, 2018Publication date: January 31, 2019Applicant: Murata Manufacturing Co., Ltd.Inventors: Ryo OKURA, Yoichi NAKATSUJI, Kosuke ISHIDA
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Publication number: 20180350506Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.Type: ApplicationFiled: May 17, 2018Publication date: December 6, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoichi NAKATSUJI, Kosuke ISHIDA, Ryo OKURA
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Publication number: 20180315541Abstract: An electronic component comprising an element body including opposite first and second end surfaces, and an upper surface connecting the first and second end surfaces; a circuit element embedded in the element body; a first lead-out electrode embedded on the first end surface side and electrically connected to the circuit element; a columnar electrode arranged separately from the first lead-out electrode in a first direction viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface; and a first via conductor connecting the first lead-out and columnar electrodes. An exposure width of the first via conductor, on the first end surface along a second direction orthogonal to the first direction viewed in the direction orthogonal to the first end surface, is smaller than the exposure width of the columnar electrode.Type: ApplicationFiled: April 11, 2018Publication date: November 1, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Ryo OKURA, Hayami KUDO, Akinori HAMADA
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Patent number: 10116278Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.Type: GrantFiled: January 9, 2017Date of Patent: October 30, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Hayami Kudo, Kenji Nishiyama, Ryo Okura
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Publication number: 20180061554Abstract: An electronic component having a main body includes a plurality of insulator layers laminated in a lamination direction. A primary coil is disposed in the main body and includes one or more primary coil conductor layers. A secondary coil is disposed in the main body and includes one or more secondary coil conductor layers. A tertiary coil is disposed in the main body and includes one or more tertiary coil conductor layers. The plurality of insulator layers includes a first insulator layer including a portion interposed between the primary coil conductor layer and the secondary coil conductor layer, a second insulator layer including a portion interposed between the secondary coil conductor layer and the tertiary coil conductor layer, and a third insulator layer including a portion interposed between the tertiary coil conductor layer and the primary coil conductor layer.Type: ApplicationFiled: August 10, 2017Publication date: March 1, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Ryo OKURA, Mizuho KATSUTA, Kosuke ISHIDA
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Publication number: 20170230026Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.Type: ApplicationFiled: January 9, 2017Publication date: August 10, 2017Applicant: Murata Manufacturing Co., Ltd.Inventors: Ryo OKURA, Hayami KUDO, Kenji NISHIYAMA
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Publication number: 20170230025Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.Type: ApplicationFiled: January 9, 2017Publication date: August 10, 2017Applicant: Murata Manufacturing Co., Ltd.Inventors: Hayami KUDO, Kenji NISHIYAMA, Ryo OKURA
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Publication number: 20170032887Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.Type: ApplicationFiled: October 14, 2016Publication date: February 2, 2017Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akinori HAMADA, Hayami KUDO, Ryo OKURA, Shinji OTANI
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Patent number: D569674Type: GrantFiled: July 18, 2006Date of Patent: May 27, 2008Assignee: Sony CorporationInventors: Ryo Okura, Naoya Sukeda
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Patent number: D642516Type: GrantFiled: November 25, 2009Date of Patent: August 2, 2011Assignee: Sony CorporationInventors: Arinobu Ueda, Ryo Okura
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Patent number: D648340Type: GrantFiled: February 12, 2010Date of Patent: November 8, 2011Assignee: Sony CorporationInventor: Ryo Okura
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Patent number: D658150Type: GrantFiled: September 23, 2011Date of Patent: April 24, 2012Assignee: Sony CorporationInventors: Tetsuro Miyazaki, Ryo Okura
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Patent number: D667786Type: GrantFiled: August 1, 2011Date of Patent: September 25, 2012Assignee: Sony CorporationInventors: Arinobu Ueda, Ryo Okura
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Patent number: D669880Type: GrantFiled: April 12, 2012Date of Patent: October 30, 2012Assignee: Sony CorporationInventor: Ryo Okura