Patents by Inventor Ryo SHINDO

Ryo SHINDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE PROCESSING APPARATUS
    Publication number: 20230382070
    Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Applicant: TDK CORPORATION
    Inventors: Yohei SATO, Hiroshi KOIZUMI, Toshinobu MIYAGOSHI, Osamu SHINDO, Seijiro SUNAGA, Mitsuyoshi MAKIDA, Makoto YAMASHITA, Yasuo KATO, Ryo SHINDO, Masashi MATSUMOTO
  • ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD
    Publication number: 20230093241
    Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.
    Type: Application
    Filed: March 4, 2021
    Publication date: March 23, 2023
    Applicant: TDK CORPORATION
    Inventors: Hiroshi KOIZUMI, Yasuo KATO, Makoto YAMASHITA, Mitsuyoshi MAKIDA, Ryo SHINDO, Osamu SHINDO, Hiroshi IIZUKA, Seijiro SUNAGA, Toshinobu MIYAGOSHI