Abstract: It is an object of the present invention to provide a liquid emulsion composition which has a good smooth texture, without containing protein such as egg, and the present invention provides a liquid emulsion composition containing water, 50 mass % or less of an oil and fat, a cyclodextrin, a water-soluble gelling agent, and a dextrin.

Abstract: According to one embodiment, a hydrogen concentration of a bottom part in a vicinity of a boundary with the insulating layer in the first silicon layer is higher than a hydrogen concentration of a part above the bottom part in the first silicon layer. And a resistivity of the bottom part in the first silicon layer is lower than a resistivity of the part above the bottom part in the first silicon layer.

Abstract: According to one embodiment, a hydrogen concentration of a bottom part in a vicinity of a boundary with the insulating layer in the first silicon layer is higher than a hydrogen concentration of a part above the bottom part in the first silicon layer. And a resistivity of the bottom part in the first silicon layer is lower than a resistivity of the part above the bottom part in the first silicon layer.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: According to one embodiment, in a dielectric isolation substrate, an insulating film having a first thickness is provided on a semiconductor substrate. A semiconductor layer of a first conductivity type having a second thickness is provided on the insulating film. An impurity diffusion layer of a second conductivity type is provided partially in a lower portion of the semiconductor layer and is in contact with the insulating film.

Abstract: A semiconductor device includes a first base layer of a first conductivity type formed on a semiconductor layer, a second base layer of a second conductivity type formed on a first surface of the first base layer, an emitter layer formed on the second base layer, a collector layer of the second conductivity type formed above the first base layer, and a barrier layer of the first conductivity type formed between the first base layer and the second base layer. The barrier layer has a depth from the first surface that is shallower than a depth of the second base layer from the first surface and a dopant concentration that is higher than a dopant concentration of the first base layer. The semiconductor device further includes an insulating film formed on the second base layer and a gate electrode formed on the insulating film.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: According to one embodiment, in a dielectric isolation substrate, an insulating film having a first thickness is provided on a semiconductor substrate. A semiconductor layer of a first conductivity type having a second thickness is provided on the insulating film. An impurity diffusion layer of a second conductivity type is provided partially in a lower portion of the semiconductor layer and is in contact with the insulating film.

Abstract: In general, according to one embodiment, a semiconductor device includes a device main body, a semiconductor substrate. The device main body includes a semiconductor substrate mounting part and a first conductor provided around the semiconductor substrate mounting part. The semiconductor substrate includes a DC-to-DC converter control circuit having a detector to detect at least one of a current flowing through the first conductor and a voltage supplied to the first conductor. The semiconductor substrate is disposed on the semiconductor substrate mounting part so that the detector comes close to the first conductor.

Abstract: A computation section (12), of a vehicle-mounted navigation system (1), which includes: a detour request receiving device (21) which receives a detour request entered by the vehicle's driver; a final-point-of-detour receiving device (22) which receives, as a final point of detour, a final point of a segment around which the driver requests to make a detour; an alternative path search device (23) which retrieves alternative paths interconnecting the current position of a vehicle and the final point of detour; and a detour link device (24) which links the final point of detour to the original route.