Patents by Inventor Ryo YATAGAI

Ryo YATAGAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light-emitting device
    Patent number: 11239401
    Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: February 1, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Tomoichiro Toyama, Hideaki Anzai, Kenya Hashimoto, Ryo Yatagai
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20200350478
    Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.
    Type: Application
    Filed: July 20, 2020
    Publication date: November 5, 2020
    Inventors: Tomoichiro TOYAMA, Hideaki ANZAI, Kenya HASHIMOTO, Ryo YATAGAI
  • Semiconductor light-emitting device
    Patent number: 10763414
    Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: September 1, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Tomoichiro Toyama, Hideaki Anzai, Kenya Hashimoto, Ryo Yatagai
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20190189878
    Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 20, 2019
    Inventors: Tomoichiro TOYAMA, Hideaki ANZAI, Kenya HASHIMOTO, Ryo YATAGAI