Abstract: To prevent a core from being damaged. A method for manufacturing a reactor includes a step of assembling a core that is configured of a core center part and a pair of core leg parts extending outwardly from the core center part to a coil in such a way that the core center part is inserted into a hollow part of the coil and the coil is sandwiched between the core center part and the pair of the core leg parts; and a step of performing resin molding by disposing the coil and the core that are assembled inside a mold and pouring resin into the mold from a gate provided on the mold to the side which is closer to the coil than the core legs parts are while having an outer surface of each of the core leg parts supported by a support part provided on the mold.

Abstract: An apparatus and a method for manufacturing a reactor capable of both absorbing a dimensional variation of a core and preventing deformation due to a resin pressure during molding are provided. An apparatus for manufacturing a reactor is provided with a core. The apparatus includes a mold including a cavity for housing the core. The mold includes a plurality of pins protruding into the cavity. When the core is disposed in the cavity, at least one of the plurality of pins is not fixed, and each of the pins functions as a positioning pin. When a molded article is molded, the pin is fixed, and each pin functions as a core support pin for supporting the core against a resin pressure during molding.

Abstract: A semiconductor device may include: a semiconductor module in which a semiconductor element is sealed in a resin package, and a heat sink is located on at least one surface of the resin package; an insulating sheet covering the heat sink; a cooling plate which is constituted of resin containing heat transfer fillers, the cooling plate having one surface and another surface, wherein the one surface covers the insulating sheet and is bonded to the at least one surface of the resin package, the other surface is provided with fins; and a cooler constituted of resin and configured to flow coolant along the fins, wherein the cooler surrounds the cooling plate in a view along a normal direction of the cooling plate, and is bonded to both ends of the resin package in the view along the normal direction.

Abstract: A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.

Abstract: A cooler includes: a base to which an object to be cooled is attached; and a fin which is fixed to a surface of the base, the fin including a plurality of graphite sheets laminated in the fin, the graphite sheet having a thermal conductivity higher in an in-plane direction than in an out-plane direction, wherein the fin is fixed to the base at end faces of the plurality of graphite sheets.

Abstract: A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.

Abstract: A semiconductor device may include: a semiconductor module in which a semiconductor element is sealed in a resin package, and a heat sink is located on at least one surface of the resin package; an insulating sheet covering the heat sink; a cooling plate which is constituted of resin containing heat transfer fillers, the cooling plate having one surface and another surface, wherein the one surface covers the insulating sheet and is bonded to the at least one surface of the resin package, the other surface is provided with fins; and a cooler constituted of resin and configured to flow coolant along the fins, wherein the cooler surrounds the cooling plate in a view along a normal direction of the cooling plate, and is bonded to both ends of the resin package in the view along the normal direction.

Abstract: A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.

Abstract: A manufacturing method for a laminated rotor includes inserting a bridge member into a magnetic flux leakage suppression hole, thus allowing a tip of the bridge member to project from an end surface of the laminated steel sheet, and bringing a die surface of a die member into pressure contact with an end surface of the laminated steel sheet and filling a molten resin into a gap between a magnet hole and a magnet body in a state where an opening of the magnet hole is closed. A length of the bridge member is larger than a thickness of the laminated steel sheet. The die member includes a housing portion. The housing portion houses the tip of the bridge member projecting from an end surface of the laminated steel sheet.

Abstract: A manufacturing method for a laminated rotor includes inserting a bridge member into a magnetic flux leakage suppression hole, thus allowing a tip of the bridge member to project from an end surface of the laminated steel sheet, and bringing a die surface of a die member into pressure contact with an end surface of the laminated steel sheet and filling a molten resin into a gap between a magnet hole and a magnet body in a state where an opening of the magnet hole is closed. A length of the bridge member is larger than a thickness of the laminated steel sheet. The die member includes a housing portion. The housing portion houses the tip of the bridge member projecting from an end surface of the laminated steel sheet.

Abstract: A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.