Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

Abstract: The present disclosure relates to a polycrystalline body of biphenol type diglycidyl ether, including an epoxy compound represented by Formula (1), and having a crystallite size of 355 ? or more and 100000 ? or less, calculated from a peak having a diffraction angle (2?) of 8.9 to 9.3 deg in a powder X-ray diffraction pattern measured with a CuK? ray, wherein in Formula (1), each of R1 to R8 is independently a hydrogen atom, an alkyl group that may have a substituent and has 1 to 12 carbon atoms, an alkoxy group that may have a substituent and has 1 to 12 carbon atoms, an aryl group that may have a substituent and has 6 to 12 carbon atoms, an alkenyl group that may have a substituent and has 2 to 12 carbon atoms, or an alkynyl group that may have a substituent and has 2 to 12 carbon atoms.

Abstract: A laser processing method including: a first step of preparing a wafer having a first region and a second region; a second step of irradiating the street with a predetermined first laser beam; and a third step of irradiating the street with a predetermined second laser beam after the second step, the first laser beam being a laser beam having processing energy for removing a part of the insulating film in the first region to leave the other part, completely removing the metal structure in the second region, and removing a part of the insulating film in the second region to leave the other part, and the second laser beam being a laser beam having processing energy for completely removing the insulating film in the first region and the insulating film in the second region after the second step.

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

Abstract: Disclosed is a laser device including: a laser light source configured to emit laser light; a phase control unit configured to receive the laser light emitted from the laser light source, to control a spatial phase of a portion of the laser light, to emit the portion of the light as control light, and to emit another portion of the laser light as non-control light; a first optical system configured to irradiate an object with the control light emitted from the phase control unit; a detector configured to detect the non-control light emitted from the phase control unit; a second optical system configured to cause the non-control light emitted from the phase control unit to converge toward a detection surface of the detector.

Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

Abstract: Disclosed is a laser device including: a laser light source configured to emit laser light; a phase control unit configured to receive the laser light emitted from the laser light source, to control a spatial phase of a portion of the laser light, to emit the portion of the light as control light, and to emit another portion of the laser light as non-control light; a first optical system configured to irradiate an object with the control light emitted from the phase control unit; a detector configured to detect the non-control light emitted from the phase control unit; a second optical system configured to cause the non-control light emitted from the phase control unit to converge toward a detection surface of the detector.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

Abstract: An image processing device includes: a detection unit which detects a target object based on edge information acquired from image data; and a judging unit which judges whether a certain region in the image data is an improper region that is not suitable for detection of the target object based on an edge pattern of edge information in the certain region and a feature pattern indicating a feature of the target object, and the detection unit detects the target object excluding a region that has been judged to be the improper region by the judging unit.

Abstract: An image processing device includes: a delimiting line detection unit configured to detect a delimiting line candidate based on image data obtained by capturing a surrounding of a vehicle; an exclusion determination unit configured to determine whether there is a parking-unavailable area in which parking of the vehicle is not permitted; and a parking space detection unit configured to detect the parking space based on the delimiting line candidate. In a case where plural parallel lines that are adjacent to the delimiting line candidate and that have a predetermined angle to the delimiting line candidate is detected, the exclusion determination unit regards an area in which the plural parallel lines are provided as the parking-unavailable area, and prohibits the parking space detection unit from detecting the parking space across the delimiting line candidate adjacent to the parking-unavailable area.

Abstract: An image processing device includes: an extraction unit which extracts, from image data taken by shooting a neighborhood of a vehicle, edge points that are to be used for detecting partition lines of a parking frame and whose edge intensity values are larger than an edge threshold value; and a correction unit which corrects the edge threshold value based on a density of the edge points extracted by the extraction unit.

Abstract: An image processing device includes: a delimiting line detection unit configured to detect a delimiting line candidate based on image data obtained by capturing a surrounding of a vehicle, the delimiting line candidate being a candidate of a delimiting line that delimits a parking space; and an exclusion determination unit configured to determine whether or not to exclude the delimiting line candidate detected by the delimiting line detection unit from the candidate of the delimiting line. In a case where a plurality of the delimiting line candidates is detected within a predetermined range in the image data, the exclusion determination unit determines whether or not to exclude the delimiting line candidate from the candidate of the delimiting line by comparing edge strength of the plurality of delimiting line candidates.

Abstract: An image processing device includes: a detection unit which detects partition line candidates that are candidates for a partition line for partitioning a parking frame, based on edge lines that are detected based on luminance of each pixel of image data taken by shooting a neighborhood of a vehicle; and a generation unit which generates an integrated partition line candidate by integrating the partition line candidates detected by the detection unit, according to a prescribed integration condition.

Abstract: An image processing device includes: an extraction unit which extracts edge lines based on image data taken by an imaging device by shooting a neighborhood of a vehicle; a selection unit which selects, as a pair of edge lines, edge lines that satisfy a prescribed condition from the extracted edge lines; an exclusion unit which, in a case where a non-paint-out region exists between the pair of edge lines, excludes quasi-edge lines that form the non-paint-out region from the pair of edge lines; and a detection unit which detects a partition line that partitions a parking frame based on the pair of edge lines from which the quasi-edge lines are excluded.

Abstract: An image processing device includes: an extraction unit which extracts a horizontal edge line in which edge points are arranged consecutively in a horizontal direction from an image taken that contains an image of a parking frame; a detection unit which detects a three-dimensional indication body to serve as a stop position indication body in the parking frame based on the horizontal edge line extracted by the extraction unit; and a determining unit which, in a case where a plurality of the horizontal edge lines are arranged in a vertical direction in an image of the three-dimensional indication body detected by the detection unit, determines the stop position regarding one of the plurality of the horizontal edge lines other than a highest horizontal edge line in the vertical direction as corresponding to a top end line of the three-dimensional indication body.