Patents by Inventor Ryoei Yamakawa

Ryoei Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5102521
    Abstract: According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes and diaphragmn in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. By simply carrying the objects to be plated in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: April 7, 1992
    Assignees: Almex Inc., Permelec Electrode Ltd.
    Inventors: Hitoshi Usuda, Ryoei Yamakawa, Kenichi Ueno, Kazuhiro Hirao