Abstract: [Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a semiconductor device including this, and a composite sheet. [Solving Means] A semiconductor protective film 10 according to an embodiment of the present invention includes a protective layer 11 formed of a non-conductive inorganic material and an adhesive layer 12 provided on one surface of the protective layer 11. The protective layer 11 includes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.

Abstract: [Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a semiconductor device including this, and a composite sheet. [Solving Means]A semiconductor protective film 10 according to an embodiment of the present invention includes a protective layer 11 formed of a non-conductive inorganic material and an adhesive layer 12 provided on one surface of the protective layer 11. The protective layer 11 includes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.

Abstract: Disclosed is an adhesive and a packaging laminate produced by using the same. The adhesive contains a polyisocyanate and a partially acid-modified polyol which is a product of reacting a polyol with anhydrotrimellitic acid and an anhydrotrimellitate ester at a ratio such that the anhydrotrimellitic acid is 10 to 70% by mass and the anhydrotrimellitate ester is 90 to 30% by mass, as the sum of the anhydrotrimellitic acid and the anhydrotrimellitate ester is 100% by mass. The packaging laminate has a first and second sheet-shaped substrates and the above adhesive through which the first and second sheet-shaped substrates are laminated.

Abstract: Disclosed is an adhesive and a packaging laminate produced by using the same. The adhesive contains a polyisocyanate and a partially acid-modified polyol which is a product of reacting a polyol with anhydrotrimellitic acid and an anhydrotrimellitate ester at a ratio such that the anhydrotrimellitic acid is 10 to 70% by mass and the anhydrotrimellitate ester is 90 to 30% by mass, as the sum of the anhydrotrimellitic acid and the anhydrotrimellitate ester is 100% by mass. The packaging laminate has a first and second sheet-shaped substrates and the above adhesive through which the first and second sheet-shaped substrates are laminated.

Abstract: A curable resin composition, which comprises a resin formed, in the presence of a transition metal complex, by polymerizing an oxidative-polymerizable compound that contains a phenol-compound-containing vegetable oil. A method for producing a curable resin composition comprising a resin formed, in the presence of a catalyst, by polymerizing an oxidative-polymerizable compound that contains a phenol-compound-containing vegetable oil, wherein the catalyst is a transition metal complex. The curable resin composition is useful as a raw material for a urushi-like coating, a friction material, a brake lining material, a brake pad material, a material for forming a coating film, a compound for a recording material, a raw material for an ink, a raw material for a coating,.a raw material for a adhesive, a raw material for an epoxy resin, a raw material for a photoresist or antioxidant, and a starting material for a functional polymer.