Patents by Inventor Ryohei Kataoka

Ryohei Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086438
    Abstract: A medium storing a program including: classifying vectors of first sentences in a file into each similar vector; generating an inverted index associating a vector of each first sentence with a position of the first sentence on the file; identifying a feature sentence from a second sentences included in a second sentences; specifying similar vectors being vectors similar to a vector of the feature sentence based on the inverted index; specifying, for each similar vector, first transition data indicating transition of vectors at positions before and after the similar vector based on the inverted index; and specifying, from pieces of first transition data obtained by performing the specifying of the first transition data on the similar vectors, transition data similar to second transition data indicating transition of vectors of sentences before and after the feature sentence, to output the transition data as a response of the search query.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: FUJITSU LIMITED
    Inventors: Masahiro KATAOKA, Ryo MATSUMURA, Ryohei NAGAURA
  • Publication number: 20240071568
    Abstract: A non-transitory computer-readable storage medium storing an information processing program that causes at least one computer to execute a process, the process includes calculating a second index indicating a position of an amino acid on a codon file based on a first index indicating positions of a plurality of codons on the codon file with respect to a plurality of codons having different base sequences indicating the same amino acid; identifying positions of amino acid sequences repeatedly expressed in the codon file based on the second index; and specifying each codon sequence corresponding to a position of each amino acid sequence repeatedly expressed in the codon file as a codon sequence having homology.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: FUJITSU LIMITED
    Inventors: Masahiro KATAOKA, Ryohei NAGAURA, Kaoru MOGUSHI
  • Patent number: 9590294
    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: March 7, 2017
    Assignee: DENSO CORPORATION
    Inventors: Yasumune Yukizaki, Tadao Suzuki, Ryohei Kataoka, Yuji Sugimoto
  • Patent number: 9583820
    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: February 28, 2017
    Assignee: DENSO CORPORATION
    Inventors: Yuji Sugimoto, Hirohito Matsui, Tadao Suzuki, Ryohei Kataoka
  • Publication number: 20160066415
    Abstract: A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.
    Type: Application
    Filed: August 25, 2015
    Publication date: March 3, 2016
    Inventors: Ryohei KATAOKA, Kouji KONDOH, Jyun AKIMICHI, Kanji OTSUKA, Yutaka AKIYAMA, Kaoru HASHIMOTO
  • Patent number: 9184495
    Abstract: A vehicular antenna apparatus includes a substrate, a circuit portion, a case, and a heat transfer path. The substrate has an antenna portion. The circuit portion is mounted on the substrate and configures at least a part of a wireless communication circuit electrically coupled with the antenna portion. The case is made of resin material and configures a protruded portion of an outer surface of a vehicle. The substrate and the circuit portion are arranged in the case. The heat transfer path is arranged between the circuit portion and the case, and has a thermal conductivity higher than air. The circuit portion is electrically coupled with the antenna portion by a solid phase diffusion bonding.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: November 10, 2015
    Assignees: DENSO CORPORATION, NIPPON SOKEN, INC.
    Inventors: Ryohei Kataoka, Tadao Suzuki, Yuji Sugimoto
  • Publication number: 20150229021
    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.
    Type: Application
    Filed: June 20, 2013
    Publication date: August 13, 2015
    Inventors: Yasumune Yukizaki, Tadao Suzuki, Ryohei Kataoka, Yuji Sugimoto
  • Publication number: 20150229020
    Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.
    Type: Application
    Filed: June 20, 2013
    Publication date: August 13, 2015
    Applicant: DENSO CORPORATION
    Inventors: Yuji Sugimoto, Hirohito Matsui, Tadao Suzuki, Ryohei Kataoka
  • Patent number: 8730123
    Abstract: A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: May 20, 2014
    Assignees: Denso Corporation, Nippon Soken, Inc.
    Inventors: Yuji Sugimoto, Tadao Suzuki, Ryohei Kataoka, Miyuki Mizoguchi
  • Publication number: 20140062808
    Abstract: A vehicular antenna apparatus includes a substrate, a circuit portion, a case, and a heat transfer path. The substrate has an antenna portion. The circuit portion is mounted on the substrate and configures at least a part of a wireless communication circuit electrically coupled with the antenna portion. The case is made of resin material and configures a protruded portion of an outer surface of a vehicle. The substrate and the circuit portion are arranged in the case. The heat transfer path is arranged between the circuit portion and the case, and has a thermal conductivity higher than air. The circuit portion is electrically coupled with the antenna portion by a solid phase diffusion bonding.
    Type: Application
    Filed: August 26, 2013
    Publication date: March 6, 2014
    Applicants: Nippon Soken, Inc., DENSO CORPORATION
    Inventors: Ryohei Kataoka, Tadao Suzuki, Yuji Sugimoto
  • Publication number: 20120299794
    Abstract: A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 29, 2012
    Applicants: Denso Corporation, Nippon Soken Inc.
    Inventors: Yuji Sugimoto, Tadao Suzuki, Ryohei Kataoka, Miyuki Mizoguchi
  • Patent number: 7378745
    Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: May 27, 2008
    Assignees: NEC Electronics Corporation, Denso Corporation
    Inventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi
  • Patent number: 7323238
    Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: January 29, 2008
    Assignees: DENSO Corporation, NEC Electronics Corporation
    Inventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
  • Patent number: 7031674
    Abstract: Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi?Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi?Pc| is larger than criteria B (|Pi?Pc|>B), so transmission power faults can be detected without detecting the transmission power.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: April 18, 2006
    Assignees: DENSO Corporation, NTT DoCoMo, Inc.
    Inventors: Ryohei Kataoka, Hisashi Takeshita, Hiroyuki Itazu, Mio Okamoto
  • Publication number: 20060068180
    Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 30, 2006
    Applicants: DENSO CORPORATION, NEC Electronics Corporation
    Inventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
  • Publication number: 20060044735
    Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
    Type: Application
    Filed: August 30, 2005
    Publication date: March 2, 2006
    Applicants: NEC ELECTRONICS CORPORATION, DENSO CORPORATION
    Inventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi
  • Patent number: 6848178
    Abstract: A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: February 1, 2005
    Assignee: Denso Corporation
    Inventors: Koji Kondo, Ryohei Kataoka, Gentaro Masuda
  • Publication number: 20030222340
    Abstract: A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.
    Type: Application
    Filed: May 14, 2003
    Publication date: December 4, 2003
    Inventors: Koji Kondo, Ryohei Kataoka, Gentaro Masuda
  • Publication number: 20030139154
    Abstract: Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi−Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi−Pc| is larger than criteria B (|Pi−Pc|>B), so transmission power faults can be detected without detecting the transmission power.
    Type: Application
    Filed: September 30, 2002
    Publication date: July 24, 2003
    Inventors: Ryohei Kataoka, Hisashi Takeshita, Hiroyuki Itazu, Mio Okamoto
  • Patent number: 4070257
    Abstract: An electrolytic process employing a diaphragm of a size of at least 1 cm in length in at least two directions, the diaphragm comprising a diaphragm base composed of fibers of fibrous structure containing inorganic fibers and a binder containing a fluorine-containing resin, the fluorine-containing resin being present in an amount of 0.5 - 60% by weight based on the weight of the diaphragm.
    Type: Grant
    Filed: January 29, 1976
    Date of Patent: January 24, 1978
    Assignee: Electrode Corporation
    Inventors: Kensuke Motani, Shunji Matuura, Ryohei Kataoka