Patents by Inventor Ryohei Yumoto
Ryohei Yumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11908768Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.Type: GrantFiled: February 15, 2022Date of Patent: February 20, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Publication number: 20230115820Abstract: When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.Type: ApplicationFiled: March 22, 2021Publication date: April 13, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Takeshi Kitahara
-
Patent number: 11462456Abstract: A power-module substrate and a heat sink made of an aluminum-impregnated silicon carbide formed by impregnating aluminum in a porous body made of silicon carbide; where yield strength of a circuit layer is ?1 (MPa), a thickness of the circuit layer is t1 (mm), a bonding area of the circuit layer and a ceramic board is A1 (mm2), yield strength of a metal layer is ?2 (MPa), a thickness of the metal layer is t2 (mm), a bonding area of the metal layer and the ceramic board is A2 (mm2); the thickness t1 is formed to be between 0.1 mm and 3.0 mm (inclusive); the thickness t2 is formed to be between 0.15 mm and 5.0 mm (inclusive); the thickness t2 is formed larger than the thickness t1; and a ratio {(?2×t2×A2)/(?1×t1×A1)} is in a range between 1.5 and 15 (inclusive).Type: GrantFiled: February 23, 2018Date of Patent: October 4, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Sotaro Oi
-
Publication number: 20220223493Abstract: An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.Type: ApplicationFiled: March 28, 2022Publication date: July 14, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Publication number: 20220173010Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Patent number: 11322424Abstract: An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.Type: GrantFiled: March 27, 2019Date of Patent: May 3, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Patent number: 11302602Abstract: A power-module substrate constructed by disposing a metal layer and a circuit layer comprising copper on a ceramic board; an aluminum layer; a copper layer; and a heat sink comprising an aluminum-impregnated silicon carbide porous body, wherein diffusion layers having an intermetallic compound of aluminum and copper are formed between the metal layer and the aluminum layer, between the aluminum layer and the copper layer, and between the copper layer and the aluminum-impregnated silicon carbide porous body, also wherein the circuit layer has a thickness t1 of 0.1-3.0 mm, the meta layer has a thickness t2 of 0.1-3.0 mm, a thickness t3 is not more than 3.0 mm, a thickness t4 is between 0.1 mm and 5.0 mm, and the ratio [(?1×t1×A1)/{(?2×t2×A2)+(?3×t3×A3)+(?4×t4×A4)}] falls within the range of 0.06-0.70.Type: GrantFiled: February 23, 2018Date of Patent: April 12, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Sotaro Oi
-
Patent number: 11289390Abstract: Provided with an insulation circuit board in which a circuit layer is joined to one side of a ceramic substrate and a metal layer made of aluminum or aluminum alloy is joined to the other side of the ceramic substrate, and a heat sink joined to the metal layer; the heat sink has a first metal layer made of copper joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of copper or copper alloy joined to an opposite side of the ceramic board material to the first metal layer; and a thickness T1 of the first metal layer is 0.3 mm to 3.0 mm inclusive and equal to or more than a thickness T2 of the second metal layer.Type: GrantFiled: March 25, 2019Date of Patent: March 29, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Patent number: 11289400Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.Type: GrantFiled: March 25, 2019Date of Patent: March 29, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Publication number: 20210296204Abstract: A power-module substrate constructed by disposing a metal layer and a circuit layer comprising copper on a ceramic board; an aluminum layer; a copper layer; and a heat sink comprising an aluminum-impregnated silicon carbide porous body, wherein diffusion layers having an intermetallic compound of aluminum and copper are formed between the metal layer and the aluminum layer, between the aluminum layer and the copper layer, and between the copper layer and the aluminum-impregnated silicon carbide porous body, also wherein the circuit layer has a thickness t1 of 0.1-3.0 mm, the meta layer has a thickness t2 of 0.1-3.0 mm, a thickness t3 is not more than 3.0 mm, a thickness t4 is between 0.1 mm and 5.0 mm, and the ratio [(?1×t1×A1)/{(?2×t2×A2)+(?3×t3×A3)+(?4×t4×A4)}] falls within the range of 0.06-0.70.Type: ApplicationFiled: February 23, 2018Publication date: September 23, 2021Inventors: Ryohei Yumoto, Sotaro Oi
-
Patent number: 11013107Abstract: An insulated circuit board having a ceramic substrate, a circuit layer on which a circuit pattern is formed and that is bonded to one surface of the ceramic substrate, and a metal layer bonded to the other surface of the ceramic substrate. The circuit layer has a first circuit layer that is bonded to the ceramic substrate and is made of aluminum and a second circuit layer that is bonded to the upper surface of the first circuit layer and is made of copper, the metal layer has a first metal layer that is bonded to the ceramic substrate and is made of aluminum and a second metal layer that is bonded to the upper surface of the first metal layer and is made of copper, and the thicknesses of the first circuit layer and the first metal layer are each 0.2 mm or more and 0.9 mm or less.Type: GrantFiled: February 26, 2019Date of Patent: May 18, 2021Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Takeshi Kitahara, Ryohei Yumoto, Yoshiyuki Nagatomo
-
Publication number: 20210118769Abstract: An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.Type: ApplicationFiled: March 27, 2019Publication date: April 22, 2021Applicant: Mitsubishi Materials CorporationInventors: Ryohei YUMOTO, Tomoya OOHIRAKI, Takeshi KITAHARA, Yoshiyuki NAGATOMO
-
Publication number: 20210028086Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.Type: ApplicationFiled: March 25, 2019Publication date: January 28, 2021Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Publication number: 20210020530Abstract: Provided with an insulation circuit board in which a circuit layer is joined to one side of a ceramic substrate and a metal layer made of aluminum or aluminum alloy is joined to the other side of the ceramic substrate, and a heat sink joined to the metal layer; the heat sink has a first metal layer made of copper joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of copper or copper alloy joined to an opposite side of the ceramic board material to the first metal layer; and a thickness T1 of the first metal layer is 0.3 mm to 3.0 mm inclusive and equal to or more than a thickness T2 of the second metal layer.Type: ApplicationFiled: March 25, 2019Publication date: January 21, 2021Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
-
Publication number: 20210007217Abstract: An insulated circuit board having a ceramic substrate, a circuit layer on which a circuit pattern is formed and that is bonded to one surface of the ceramic substrate, and a metal layer bonded to the other surface of the ceramic substrate. The circuit layer has a first circuit layer that is bonded to the ceramic substrate and is made of aluminum and a second circuit layer that is bonded to the upper surface of the first circuit layer and is made of copper, the metal layer has a first metal layer that is bonded to the ceramic substrate and is made of aluminum and a second metal layer that is bonded to the upper surface of the first metal layer and is made of copper, and the thicknesses of the first circuit layer and the first metal layer are each 0.2 mm or more and 0.9 mm or less.Type: ApplicationFiled: February 26, 2019Publication date: January 7, 2021Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Takeshi Kitahara, Ryohei Yumoto, Yoshiyuki Nagatomo
-
Publication number: 20200027815Abstract: A power-module substrate and a heat sink made of an aluminum-impregnated silicon carbide formed by impregnating aluminum in a porous body made of silicon carbide; where yield strength of a circuit layer is ?1 (MPa), a thickness of the circuit layer is t1 (mm), a bonding area of the circuit layer and a ceramic board is A1 (mm2), yield strength of a metal layer is ?2 (MPa), a thickness of the metal layer is t2 (mm), a bonding area of the metal layer and the ceramic board is A2 (mm2); the thickness t1 is formed to be between 0.1 mm and 3.0 mm (inclusive); the thickness t2 is formed to be between 0.15 mm and 5.0 mm (inclusive); the thickness t2 is formed larger than the thickness t1; and a ratio {(?2×t2×A2)/(?1×t1×A1)} is in a range between 1.5 and 15 (inclusive).Type: ApplicationFiled: February 23, 2018Publication date: January 23, 2020Inventors: Ryohei Yumoto, Sotaro Oi