Patents by Inventor Ryoichi Fukusawa

Ryoichi Fukusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for inspecting wire breaking of integrated circuit
    Patent number: 6980010
    Abstract: An apparatus that inspects wire breaking of a semiconductor integrated circuit includes a voltage applying device (12), a light pulse source (14), a scanning device (16), an electromagnetic wave detection device (18), and a wire breaking detection device (20). The voltage applying device (12) maintains a semiconductor integrated circuit in a state where a predetermined voltage is being applied thereto. The light pulse source (14) generates an ultrashort light pulse (2). The scanning device (16) two-dimensionally scans and irradiates the two-dimensional circuit of the semiconductor integrated circuit by using the ultrashort light pulse (2). The electromagnetic wave detection device (18) detects an electromagnetic wave (3) radiated from a position irradiated with the ultrashort light pulse on the semiconductor integrated circuit. The wire breaking detection device (20) detects wire breaking of the irradiated position based on presence and absence or intensity of the electromagnetic wave.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: December 27, 2005
    Assignees: Riken, Aisin Seiki Kabushiki Kaisha
    Inventors: Masayoshi Tonouchi, Kodo Kawase, Tomoya Hirosumi, Ryoichi Fukusawa
  • Method and apparatus for inspecting wire breaking of integrated circuit
    Publication number: 20040246011
    Abstract: An apparatus that inspects wire breaking of a semiconductor integrated circuit includes a voltage applying device (12), a light pulse source (14), a scanning device (16), an electromagnetic wave detection device (18), and a wire breaking detection device (20). The voltage applying device (12) maintains a semiconductor integrated circuit in a state where a predetermined voltage is being applied thereto. The light pulse source (14) generates an ultrashort light pulse (2). The scanning device (16) two-dimensionally scans and irradiates the two-dimensional circuit of the semiconductor integrated circuit by using the ultrashort light pulse (2). The electromagnetic wave detection device (18) detects an electromagnetic wave (3) radiated from a position irradiated with the ultrashort light pulse on the semiconductor integrated circuit. The wire breaking detection device (20) detects wire breaking of the irradiated position based on presence and absence or intensity of the electromagnetic wave.
    Type: Application
    Filed: January 21, 2004
    Publication date: December 9, 2004
    Applicants: RIKEN, AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masayoshi Tonouchi, Kodo Kawase, Tomoya Hirosumi, Ryoichi Fukusawa