Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A replica in which a bone part and soft tissue are reproduced with physical properties close to those of real organs and tissues in term of shape, color, apparent textures, softness and hardness, and which allows a trainee to practice surgical techniques so that part of the replica can be incised by surgical manipulation, together with a production method for the replica. The bone part and soft tissue are reproduced with physical properties close to those of real tissue. The incisable part is replaceable as a component, whereas the body part of the replica can be used repeatedly.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A detergent composition for cleaning a precision part, comprising an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water. The detergent composition can be used for cleaning a precision part such as a metal part, an electronic part, a semiconductor part or a liquid crystal display panel.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A process for producing a molded article comprised of polyurethane is provided, comprising the steps of pouring or injecting a liquid molding material into a mold under the condition that the contact angle between the liquid molding material and the inner surface of the mold is adjusted to not more than 30° by applying the surface-treating agent to the inner surface of the mold, and curing the liquid molding material. A surface-treating agent is also provided which reduces the contact angle between the liquid molding material and a flat plate made of the same material as the mold to not more than 30°. when the surface-treating agent is applied to the flat plate and the liquid molding material is dropped thereon.

Abstract: A detergent composition for cleaning a precision part, comprising an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water. The detergent composition can be used for cleaning a precision part such as a metal part, an electronic part, a semiconductor part or a liquid crystal display panel.

Abstract: Process for producing a molded article comprising pouring or injecting a liquid molding material into a mold in the presence of a surface-treating agent comprising a contact angle-reducing substance under the condition that the contact angle between the liquid molding material and the inner surface of the mold is not more than 30°, and curing the liquid molding material; surface-treating agent comprising a contact angle-reducing substance which reduces the contact angle between the liquid molding material and a flat plate made of the same material as the mold to not more than 30°; method for reducing surface voids during molding, comprising using the above surface-treating agent; and use of the above surface-treating agent for reducing surface voids. The molded article has a shape accurately corresponding to the shape of an inner surface of a mold.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A movable automatic bolt driving apparatus sequentially drives a plurality of bolts positioned substantially in line on flanges of elongated concrete molding frame segments for producing columnar concrete products. The apparatus has a vertically movable bolt driver unit and an air-cylinder unit. When the bolt driver unit drives a bolt in a state that the socket and the bolt are non-concentrically engaged with each other, the air-cylinder unit causes to properly reposition the bolt driver unit. At least a part of the bolt driver unit, which is normally disposed vertically, is pivotable with a horizontal pivotal axis orthogonal to the moving direction of the apparatus. The apparatus also has a flange follower for guiding the bolt driver unit. At least a part of the flange follower, which includes a roller having a vertical rotating axis, is pivotable about a vertical rotational axis.

Abstract: A supporting shaft 11 that can be inserted through a center hole 5a in each of cured resin disks 5 and which has a bottom plate in a disk form at an end, as well as a plurality of spacer disks 12 each having a center hole through which the supporting shaft 11 can be inserted are used in the process of manufacturing GC (glass-like carbon) by baking to carbonize the cured resin disks 5. The cured resin disks 5 are stacked alternately with the spacer disks 12 on the supporting shaft 11 in an erect position that is inserted through the center holes in each of the cured resin and spacer disks. The stack is then baked in a baking furnace. By so doing, the cured resin disks can be set up easily and the baking furnace can be operated to its full capacity.

Abstract: There is provided a socket mechanism for rotating a bolt or nut, or like fastening piece, that is used with a vertical type powered bolt/nut driving apparatus. The socket mechanism has a spindle that can be coupled to a drive shaft of the driving apparatus, a socket for engaging with the bolt or nut having a guide at the bottom end thereof for facilitating the object bolt or nut to slip into the socket, a socket holding core having a downwardly tapered mid section, and a generally cylindrically-shaped core holder fixedly attached to the spindle having a bottom opening. The socket is fixedly attached to the low end of the socket holding core. The tapered part of the socket holding core freely lies on the rim of the bottom opening of the core holder in a manner that a lower part of the core and the socket are below the opening and suspending from the core holder.