Abstract: Included are: a cylindrical body (cylindrical portion 16) provided with a shaft portion (18); and a first valve body (11) that is in close contact with the shaft portion to close an opening portion (22) of the cylindrical body, and is separated from the shaft portion when pressure (P) in the cylindrical body rises to a threshold (Pth) or higher by gas that has entered the cylindrical body, to release the gas from the cylindrical body to the outside. The valve body includes a closing portion (40) that receives the pressure (P) of the gas in the cylindrical body. The pressure received by the closing portion (40) serves as a valve opening force. As a result, the discharge characteristics of the gas filling a case are improved to enhance a pressure regulation function.

Abstract: A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vessel is configured to accommodate the substrate therein. The measuring unit is configured to measure a value indicating an amount of moisture in the processing vessel. The controller is configured to determine whether or not bonding strength between the substrate and the another substrate, when it is assumed that the substrate modified in the processing vessel is bonded to the another substrate, is good based on the value indicating the amount of moisture in the processing vessel measured by the measuring unit.

Abstract: A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.

Abstract: A surgical operation system includes a US signal output section, an HV signal output section, a probe having a treatment section which has an HV signal applied thereto and vibrates by ultrasound, an HV signal main controller that performs feedback control of the HV signal output section based on the HV signal, a US signal main controller that performs feedback control of the US signal output section based on a US signal, and an HV signal auxiliary controller that controls the HV signal output section based on the US signal, and has a response time shorter than that of the HV signal main controller.

Abstract: A surgical operation system includes a US signal output section, an HV signal output section, a probe having a treatment section which has an HV signal applied thereto and vibrates by ultrasound, an HV signal main controller that performs feedback control of the HV signal output section based on the HV signal, a US signal main controller that performs feedback control of the US signal output section based on a US signal, and an HV signal auxiliary controller that controls the HV signal output section based on the US signal, and has a response time shorter than that of the HV signal main controller.

Abstract: A surgical operation system includes a US signal output section, an HV signal output section, a probe having a treatment section which has an HV signal applied thereto and vibrates by ultrasound, an HV signal main control section that performs feedback control of the HV signal output section based on the HV signal, a US signal main control section that performs feedback control of the US signal output section based on a US signal, and an HV signal auxiliary control section that controls the HV signal output section based on the US signal, and has a response time shorter than that of the HV signal main control section.