Abstract: Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.

Abstract: Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation.

Abstract: The piezoelectric vibrating piece (20) comprises a base portion (29) having an adhesive area on a first surface of electrically conductive adhesive 31 for mounting, a pair of vibrating arms (21) extending in a first direction from one edge of the base portion, base electrodes (23a, 25a) arranged in the base portion, an exciting electrode (23c, 25c) extending in a first direction and connecting the base electrode to excite a pair of vibrating arms. The area where the base electrodes (23a, 25a) conduct the electrically conductive adhesive (31) is smaller than the adhesive area (33).

Abstract: An object is to provide a tuning-fork type piezoelectric unit in which as well as maintaining the vibration characteristics in the stationary condition when miniaturized, the bond strength is maintained, and also the frequency change for before and after a drop impact test is suppressed.

Abstract: There is disclosed a manufacturing method of a tuning-fork type quartz crystal resonator, in which a simple step can just be added to the existing manufacturing process to prevent generation of short-circuit at a crotch portion and largely improve yield. On a quartz crystal wafer, a metal film is formed on a quartz crystal substrate processed into a tuning-fork form by evaporation or sputtering, the metal film is patterned into desired electrode and wiring line shapes by photolithography/etching, and then a crotch portion 30 is irradiated with laser from a direction substantially vertical to a wafer surface to remove a non-etched metal film portion in the manufacturing method of the tuning-fork type quartz crystal resonator.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).

Abstract: To provide a secondary battery controlling apparatus and a controlling method that can keep a storage amount of a secondary battery used for supply and demand control of a power system not close to 100% or 0%. The present invention is a power supply and demand controlling apparatus of a small-scaled power system 1 including distributed power supplies 31, 32, . . .

Abstract: A tuning-fork type piezoelectric vibrating piece (20) is comprised of a base portion (23) comprising a piezoelectric material, a pair of vibrating arms (21) extends parallel from the base portion with a first thickness, a excitation electrode film (33, 34) formed on the vibrating arms, a pair of tuning portions (28) formed at the distal ends of the vibrating arms (21) with a second thickness which is less than the first thickness; and a metal film (18) formed on at least one surface o the tuning portion.

Abstract: A piezoelectric frame (20) is comprised of a tuning-fork type piezoelectric vibrating piece (30) having a pair of vibrating arms (21) extending from a base portion (23) wherein excitation electrodes are formed on the vibrating arms, an outer frame (22) surrounding the tuning-fork type piezoelectric vibrating piece, a pair of supporting arms (26) extending from the base portion to the outer frame portion and supporting the tuning-fork type piezoelectric vibrating piece; and an acute angle portion (11) formed on a side surface between the outer frame and the tuning-fork type piezoelectric vibrating piece and having an acute angle seen from Z-direction.

Abstract: Piezoelectric devices are disclosed that include a chip plate sandwiched between a lid plate and a base plate. The chip plate includes a tuning-fork type piezoelectric vibrating piece surrounded by an outer frame. The lid plate includes a concavity on its inner major surface, and the base plate includes a concavity on its inner major surface. The lid plate, chip plate, and base plate are bonded together to form a package containing the piezoelectric vibrating piece. The tuning-fork type piezoelectric vibrating piece includes a base having an X-direction width and at least pair of vibrating arms extending from the base in a Y-direction. The tuning-fork type piezoelectric vibrating piece is coupled to the outer frame by supporting arms extending in the Y-direction outboard of the vibrating arms. The concavity of the lid plate includes at least one base-movement “buffer” extending in the X-direction at a location corresponding to the base of the vibrating piece.

Abstract: Methods are disclosed for manufacturing piezoelectric devices. An exemplary method comprises the step of bonding a lid wafer, a piezoelectric frame wafer (having a vibrating piece and a outer frame surrounding the vibrating piece), and a base wafer (having at least one wiring through-hole) together. A surface of a unit (typically ball-shaped) of eutectic metal is cleaned and then arranged on the through-hole. The unit of eutectic metal is then melted in a vacuum or inert gas environment to allow the eutectic metal to enter the through-hole.

Abstract: Tuning-fork-type crystal vibrating pieces are disclosed that have a base and a pair of vibrating arms extending from one side of the base in a designated longitudinal direction. A root portion is situated between the vibrating arms, and includes a first taper surface. Extending outboard of the vibrating arms from respective sides of the base are respective supporting arms that extend in the designated direction. Between each supporting arm and the respective vibrating arm is a respective supporting-arm root portion. Each supporting-arm root portion has a second taper surface in the thickness direction of the base.

Abstract: In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.

Abstract: There is disclosed a manufacturing method of a tuning-fork type quartz crystal resonator, in which a simple step can just be added to the existing manufacturing process to prevent generation of short-circuit at a crotch portion and largely improve yield. On a quartz crystal wafer, a metal film is formed on a quartz crystal substrate processed into a tuning-fork form by evaporation or sputtering, the metal film is patterned into desired electrode and wiring line shapes by photolithography/etching, and then a crotch portion 30 is irradiated with laser from a direction substantially vertical to a wafer surface to remove a non-etched metal film portion in the manufacturing method of the tuning-fork type quartz crystal resonator.

Abstract: There is disclosed a manufacturing method of a tuning-fork type quartz crystal resonator, in which a simple step can just be added to the existing manufacturing process to prevent generation of short-circuit at a crotch portion and largely improve yield. On a quartz crystal wafer, a metal film is formed on a quartz crystal substrate processed into a tuning-fork form by evaporation or sputtering, the metal film is patterned into desired electrode and wiring line shapes by photolithography/etching, and then a crotch portion 30 is irradiated with laser from a direction substantially vertical to a wafer surface to remove a non-etched metal film portion in the manufacturing method of the tuning-fork type quartz crystal resonator.

Abstract: The piezoelectric vibrating piece (20) comprises a base portion (29) having an adhesive area on a first surface of electrically conductive adhesive 31 for mounting, a pair of vibrating arms (21) extending in a first direction from one edge of the base portion, base electrodes (23a, 25a) arranged in the base portion, an exciting electrode (23c, 25c) extending in a first direction and connecting the base electrode to excite a pair of vibrating arms. The area where the base electrodes (23a, 25a) conduct the electrically conductive adhesive (31) is smaller than the adhesive area (33).

Abstract: An object is to provide a tuning-fork type piezoelectric unit in which as well as maintaining the vibration characteristics in the stationary condition when miniaturized, the bond strength is maintained, and also the frequency change for before and after a drop impact test is suppressed.

Abstract: A method and apparatus for correcting drift of the beam irradiation position during automated FIB (focused ion beam) processing with a reference image-setting unit, an image read-in unit for reading in images of the reference image region during the FIB processing, an arithmetic-and-control unit for finding the direction and amount of image deviation between the subsequent images, and a beam deflection system-adjusting unit for correcting the beam deflection system by correcting the image deviation based on the deviation in response to the output from the arithmetic-and-control unit. The arithmetic-and-control unit optimizes the brightness or contrast of the reference image.

Abstract: There is disclosed a manufacturing method of a tuning-fork type quartz crystal resonator, in which a simple step can just be added to the existing manufacturing process to prevent generation of short-circuit at a crotch portion and largely improve yield. On a quartz crystal wafer, a metal film is formed on a quartz crystal substrate processed into a tuning-fork form by evaporation or sputtering, the metal film is patterned into desired electrode and wiring line shapes by photolithography/etching, and then a crotch portion 30 is irradiated with laser from a direction substantially vertical to a wafer surface to remove a non-etched metal film portion in the manufacturing method of the tuning-fork type quartz crystal resonator.