Patents by Inventor Ryoichi Ide

Ryoichi Ide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filler for electronic element encapsulation resin and electronic element encapsulation resin composition containing the same
    Patent number: 4615741
    Abstract: According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.
    Type: Grant
    Filed: November 8, 1984
    Date of Patent: October 7, 1986
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Akira Kobayashi, Ryoichi Ide, Hirotaka Koga