Abstract: An electronic component module includes a substrate, a plurality of electronic components, an insulating sealing resin, a conductive film, and a conductive chip component. The plurality of electronic components includes an electronic component having a grounding terminal at a side end portion, and are mounted on the main surface of the substrate. The sealing resin covers the plurality of electronic components and the main surface side of the substrate. The conductive film covers the outer surface of the sealing resin. The conductive chip component is disposed on a side of the electronic component opposite to the substrate in a normal direction of the main surface, and is connected to a grounding terminal of the electronic component. The conductive film is connected to the conductive chip component.

Abstract: A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump includes a portion exposed through the opening. The bump includes a first portion that is connected to the first electrode, and a second portion that is located farther from the first electrode than the first portion and is connected to the first portion. The bump has a constriction at a boundary between the first portion and the second portion. When viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion.

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

Abstract: A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

Abstract: A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

Abstract: A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

Abstract: A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a pressing surface, providing a mounting substrate, keeping the pressing surface of the bonding tool in contact with a reverse surface of the electronic device element and applying an ultrasonic wave to the bonding tool, thereby mounting the electronic device element on the mounting substrate. The maximum length of the pressing surface of the bonding tool in the ultrasonic-wave-oscillation direction is greater than about 0.5 times the maximum length of the reverse surface of the electronic device element in the ultrasonic-wave-oscillation direction.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is-located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.