Abstract: According to one embodiment, a behavior detection apparatus includes an image acquisition unit, a characteristic acquisition unit, a behavior identification unit, and a detection unit. The image acquisition unit is configured to acquire the image data about an object to detect. The characteristic acquisition unit is configured to acquire characteristic data about the object, from the image data. The behavior identification unit is configured to identify the behavior of the object on the basis of the characteristic data. The detection unit is configured to compare the behavior identified by the behavior identification unit with the scheduled behavioral data representing the behavior the object is supposed to exhibit, thereby to detect abnormal behavior by the object.

Abstract: According to one embodiment, a behavior detection apparatus includes an image acquisition unit, a characteristic acquisition unit, a behavior identification unit, and a detection unit. The image acquisition unit is configured to acquire the image data about an object to detect. The characteristic acquisition unit is configured to acquire characteristic data about the object, from the image data. The behavior identification unit is configured to identify the behavior of the object on the basis of the characteristic data. The detection unit is configured to compare the behavior identified by the behavior identification unit with the scheduled behavioral data representing the behavior the object is supposed to exhibit, thereby to detect abnormal behavior by the object.

Abstract: According to one embodiment, a monitoring system is provided, which has a personal authentication unit and a camera. The personal authentication unit is provided near a security gate and authenticates a person allowed to pass through the security gate. The camera photographs an area near the security gate, in which the personal authentication unit is provided. The monitoring system further has a data generation unit configured to generate personal attribute data about the person authenticated by the personal authentication unit, a person identification unit configured to identify the person authenticated, on the basis of video data generated by the camera, and a monitoring data generation unit configured to generate monitoring data composed of video data and metadata. The video data represents an image including the person identified by the person identification unit. The metadata is associated with the video data and containing the personal attribute data.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: A security method for a vehicle safe driving system provides drivers information for safe driving, that is, when a sensor does not detect any danger when there is a danger on the road, when there are some limits in the system operations, or when a portion of the system does not work.

Abstract: Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn and a remainder of Cu to at least the melting point of Cu without the pieces contacting each other to give them a spherical shape and cooling the resulting spheres to form solid balls. The minute copper balls which are obtained comprises 0.01-0.5 wt % of Zn and a remainder of Cu and have a spherical shape with a diameter in the range of 50-1000 &mgr;m.

Abstract: The security method for a vehicle safe driving system according to this invention is providing drivers to notice information for safe driving, when a sensor does not detect any danger when there is a danger on the road, when there are some limits in the system operations, or when a portion of the system does not work.

Abstract: Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn and a remainder of Cu to at least the melting point of Cu without the pieces contacting each other to give them a spherical shape and cooling the resulting spheres to form solid balls. The minute copper balls which are obtained comprises 0.01-0.5 wt % of Zn and a remainder of Cu and have a spherical shape with a diameter in the range of 50-1000 &mgr;m.

Abstract: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

Abstract: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.