Abstract: A sensor for detecting an analyte in liquid includes a base substrate provided with openings and electrode lands on one surface thereof and SAW elements each provided with a sensing portion having at least one IDT electrode on one side. The SAW elements are mounted on the base substrate with bump electrodes by a flip-chip bonding method so that the sensing portions of the SAW elements face the openings of the base substrate. At least one of the sensing portions is coated with a reaction membrane which binds to an analyte.

Abstract: A sensor for detecting an analyte in liquid includes a base substrate provided with openings and electrode lands on one surface thereof and SAW elements each provided with a sensing portion having at least one IDT electrode on one side. The SAW elements are mounted on the base substrate with bump electrodes by a flip-chip bonding method so that the sensing portions of the SAW elements face the openings of the base substrate. At least one of the sensing portions is coated with a reaction membrane which binds to an analyte.

Abstract: A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Abstract: An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste (4) is supplied to electrodes (2) for receiving surface-mount components (40), and the surface-mount components (40) are provisionally fixed on the electrodes (2) with the high-temperature solder paste (4). In addition, flux (5) is applied to an electrode (1) for receiving an IC (30a) that is provided with eutectic solder bumps (31) or on the eutectic solder bumps (31), and the IC (30a) is provisionally fixed on the electrode (1) with the flux (5). Then, a wiring substrate (10) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components (40) and the IC (30a) are reflow-soldered.

Abstract: An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste (4) is supplied to electrodes (2) for receiving surface-mount components (40), and the surface-mount components (40) are provisionally fixed on the electrodes (2) with the high-temperature solder paste (4). In addition, flux (5) is applied to an electrode (1) for receiving an IC (30a) that is provided with eutectic solder bumps (31) or on the eutectic solder bumps (31), and the IC (30a) is provisionally fixed on the electrode (1) with the flux (5). Then, a wiring substrate (10) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components (40) and the IC (30a) are reflow-soldered.

Abstract: A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Abstract: An electronic component connecting method of connecting a first electronic component and a second electronic component via a connecting structure like a bump electrode in which a thermosetting conductive adhesive is applied on connecting electrodes on an IC chip, which serves as the first electronic component, by printing or the like, and is hardened, whereby tapered projecting electrodes as bump electrodes are formed to project in the form of, for example, a circular cone. Then, a conductive adhesive for connection is applied on the projecting electrodes. Before the conductive adhesive for connection is hardened, the IC chip is aligned with a wiring board, which serves as the second electronic component, so that the ends of the projecting electrodes and connecting electrodes on the wiring board are in contact with each other. In this aligned state, the conductive adhesive for connection is hardened.

Abstract: An electronic component connecting method of connecting a first electronic component and a second electronic component via a connecting structure like a bump electrode in which a thermosetting conductive adhesive is applied on connecting electrodes on an IC chip, which serves as the first electronic component, by printing or the like, and is hardened, whereby tapered projecting electrodes as bump electrodes are formed to project in the form of, for example, a circular cone. Then, a conductive adhesive for connection is applied on the projecting electrodes. Before the conductive adhesive for connection is hardened, the IC chip is aligned with a wiring board, which serves as the second electronic component, so that the ends of the projecting electrodes and connecting electrodes on the wiring board are in contact with each other. In this aligned state, the conductive adhesive for connection is hardened.

Abstract: To provide a wash tank which is excellent in washing effect with a simple structure, compact, highly practical and effective in washing small molded parts made of rubber or plastic, the wash tank includes a sealable lid having a washing fluid outlet, a conical bottom wall portion having a washing fluid inlet and a cylindrical side wall portion, having a draft tube in a bugle-like shape a bottom end and an upper end of which are expanded and which is disposed at the inside of the tank and a partition plate arranged at a front face of the draft tube and further provided with a jet stream nozzle at a washing fluid inlet portion where the tank is constituted reversibly.

Abstract: An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.

Abstract: A tank transportation system comprises rails, stations, and a conveying truck moving on the rails between the stations under computer control. The conveying truck suspends a tank, which performs predetermined operations at the station, delivers and/or receives it to and from the station, and transports it to other stations in order. The system is used preferably for producing flowable composites.

Abstract: An opening 11 is formed in a region of a circuit board 10 opposite to a vibration region E of a piezoelectric element 5. The piezoelectric element 5 is mounted on the circuit board 10, and electrode connection portions 9 of the piezoelectric element 5 are connected with and fixed to the circuit board by a solder. In succession, soldered connection portions kept away from the vibration region E of the piezoelectric element 5 are filled with a bonding agent 8. Thereupon, an excess bonding agent 8 with which the soldered connection portions are filled is eliminated by the opening 11, and hence is prevented from invading the vibration region E of the piezoelectric element 5. Further, any stress exerted on the circuit board 10 is dispersed because of its being mostly received by the bonding agent 8, and hence any stress exerted on the piezoelectric element 5 is reduced.

Abstract: This invention relates to an apparatus for conveying cops and bobbins for directly connecting a ring frame with a winder wherein one operation to feed those cops which are doffed onto the transport-bands on both the right and left sides of the ring frame to the subsequent process from one end of each of the transport-bands and the other operation to receive bobbins needed for the next doffing onto the transport-band are together simultaneously performed, with these two simultaneous operations being repeated. This invention has no provision of a random stock zone and the substantial function of bobbin stock is given to the transport-band, and the bobbin returned from the winder is adjusted in alignment thereof by the bobbin aligning device and conveyed by the bobbin stock conveyor and dropped onto the transport-band.