Patents by Inventor Ryoichi Toyoshima

Ryoichi Toyoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931099
    Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: March 19, 2024
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Akio Yoshida, Ryoichi Toyoshima, Mitsunori Sasaki, Hiroyasu Hasegawa
  • Publication number: 20200200617
    Abstract: Provided is a pressure sensor that is suitable for measuring a wide range of pressures and has a small footprint. The pressure sensor is constituted by a wiring sheet 10 having: a plurality of sensor devices U1 and U2 including electrodes 19a and 19b, and a conductive film 15 disposed opposite to the electrodes 19a and 19b, and stacked in a direction in which the conductive film 15 is disposed against the electrodes 19a and 19b; a common input line 21 for inputting electrical signals to the plurality of sensor devices U1 and U2; and a common output line 22 for outputting the electrical signals from the plurality of sensor devices.
    Type: Application
    Filed: March 26, 2019
    Publication date: June 25, 2020
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Ryoichi TOYOSHIMA
  • Publication number: 20190239946
    Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.
    Type: Application
    Filed: January 14, 2019
    Publication date: August 8, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Ryoichi TOYOSHIMA, Mitsunori SASAKI, Hiroyasu HASEGAWA
  • Patent number: 10359326
    Abstract: This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 23, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Ryoichi Toyoshima, Keizo Toyama, Hirokazu Ohdate, Masayuki Iwase
  • Patent number: 10048141
    Abstract: Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: August 14, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
  • Patent number: 9883584
    Abstract: [Problem to be Solved] A multilayer flexible printed circuit board having a strip line advantageous to folding is provided. [Solution] A multilayer flexible printed circuit board 100 of an embodiment is a multilayer flexible printed circuit board having a strip line foldable at a folding part F1, the board including: a flexible insulative substrate 30; an inner layer circuit pattern 5 provided inside the flexible insulative substrate 30 and including a signal line 6 extending in a predetermined direction; a ground thin film 14a constituting a ground layer at least in the folding part F1 out of a ground layer of the strip line and constituted of a nonelectrolytic plating coat 14 formed on the flexible insulative substrate 30; and a protective layer 20 that covers the ground thin film 14a and is in close contact with an exposed part 19 from which the flexible insulative substrate 30 is exposed.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: January 30, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Ryoichi Toyoshima
  • Publication number: 20170280554
    Abstract: [Problem to be Solved] A multilayer flexible printed circuit board having a strip line advantageous to folding is provided. [Solution] A multilayer flexible printed circuit board 100 of an embodiment is a multilayer flexible printed circuit board having a strip line foldable at a folding part F1, the board including: a flexible insulative substrate 30; an inner layer circuit pattern 5 provided inside the flexible insulative substrate 30 and including a signal line 6 extending in a predetermined direction; a ground thin film 14a constituting a ground layer at least in the folding part F1 out of a ground layer of the strip line and constituted of a nonelectrolytic plating coat 14 formed on the flexible insulative substrate 30; and a protective layer 20 that covers the ground thin film 14a and is in close contact with an exposed part 19 from which the flexible insulative substrate 30 is exposed.
    Type: Application
    Filed: August 1, 2016
    Publication date: September 28, 2017
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Ryoichi TOYOSHIMA
  • Publication number: 20170089778
    Abstract: A pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer; the pressure sensing film being arranged opposing to the sensor electrode; the insulating layer having an opening, and being provided between the support substrate and the pressure sensing film; at least a part of an opening edge of the opening being fallen on the sensor electrode; an exposed part as a part of the sensor electrode being exposed inside the opening, leaving a buried part as the other part of the sensor electrode buried under the insulating layer.
    Type: Application
    Filed: July 28, 2016
    Publication date: March 30, 2017
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Ryoichi Toyoshima, Keizo Toyama, Hirokazu Ohdate, Masayuki Iwase
  • Patent number: 9574955
    Abstract: A pressure sensing element (100) includes a support substrate (11); a sensor electrode (12) supported by the support substrate (11); a pressure sensing film (14) functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (12); and an insulating layer (13) which keeps the sensor electrode (12) and the pressure sensing film (14) apart from each other by a predetermined distance A, and has formed therein an opening (20) in which the sensor electrode (12) is exposed to the pressure sensing film (14), the insulating layer (13) having an aperture wall (13b) which partitions the opening (20), and an aperture end (top aperture end (13a)) faced to the pressure sensing film (14), and the insulating layer (13) being increased in height, measured from the support substrate (11), continuously towards the opening (20).
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: February 21, 2017
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
  • Publication number: 20160363491
    Abstract: A pressure sensing element (100) includes a support substrate (11); a sensor electrode (12) supported by the support substrate (11); a pressure sensing film (14) functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (12); and an insulating layer (13) which keeps the sensor electrode (12) and the pressure sensing film (14) apart from each other by a predetermined distance A, and has formed therein an opening (20) in which the sensor electrode (12) is exposed to the pressure sensing film (14), the insulating layer (13) having an aperture wall (13b) which partitions the opening (20), and an aperture end (top aperture end (13a)) faced to the pressure sensing film (14), and the insulating layer (13) being increased in height, measured from the support substrate (11), continuously towards the opening (20).
    Type: Application
    Filed: January 14, 2015
    Publication date: December 15, 2016
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
  • Publication number: 20160327441
    Abstract: Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).
    Type: Application
    Filed: December 24, 2014
    Publication date: November 10, 2016
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
  • Patent number: 8040198
    Abstract: A microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors located across an insulating layer from the signal lines, characterized in that wiring pitch of the grounding conductors is 1/n of width of the signal lines (where n is a natural number of 1 or 2).
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: October 18, 2011
    Assignee: Nippon Mektron, Ltd.
    Inventor: Ryoichi Toyoshima
  • Publication number: 20100231331
    Abstract: The present invention provides a microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors 5, 9, 12, 15, 19, or 26 located across an insulating layer 3, 10, or 13 from the signal lines 4, 6, 8, 11, 14, 18, or 25, characterized in that wiring pitch of the grounding conductors is 1/n of width of the signal lines (where n is a natural number of 1 or 2).
    Type: Application
    Filed: January 31, 2008
    Publication date: September 16, 2010
    Inventor: Ryoichi Toyoshima