Patents by Inventor Ryoji HARATA

Ryoji HARATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE
    Publication number: 20150155227
    Abstract: In a multichip thin package requiring a thickness of submillimeter region, it is difficult to thin the package if the chips are mounted over a usual die pad. According to a technique of the present application, in a manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.
    Type: Application
    Filed: February 12, 2015
    Publication date: June 4, 2015
    Inventors: Ryoji HARATA, Hiroaki NARITA
  • Manufacturing method of semiconductor device
    Patent number: 8987063
    Abstract: A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: March 24, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Ryoji Harata, Hiroaki Narita
  • MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    Publication number: 20120208324
    Abstract: In a multichip thin package requiring a thickness of submillimeter region, it is difficult to thin the package if the chips are mounted over a usual die pad. According to a technique of the present application, in a manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 16, 2012
    Inventors: Ryoji HARATA, Hiroaki Narita