Abstract: A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.

Abstract: A method of manufacturing a liquid ejection head includes the steps of (1) forming a recess in a second surface of a substrate to form a common supply port, (2) forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and (3) performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other.

Abstract: A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.

Abstract: A liquid discharge head includes a substrate having an energy generating element configured to generate energy required to discharge liquid, a discharge port configured to discharge the liquid and provided in an opposed relationship to the energy generating element, a wall member defining a chamber adapted to store the energy required to discharge liquid the energy being generated by the energy generating element, a discharge portion defining a fluid path connecting the chamber and the discharge port, a supply path facilitating supplying the liquid into the chamber, and a pair of hollow portions provided in the wall member, wherein the hollow portions oppose each other and sandwich at least the entire discharge port in a direction from the discharge port to the substrate, and the hollow portions are independent of the chamber.

Abstract: A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.

Abstract: A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings ar

Abstract: Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface.

Abstract: An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.

Abstract: A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

Abstract: A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings ar

Abstract: A method for manufacturing a liquid discharge head includes the steps of: forming a solid layer for forming a flow path on a substrate on which an energy generating element is arranged to generate energy that is used to discharge liquid; forming, on the substrate where the solid layer is mounted, a coating layer for coating the solid layer; forming a discharge port used to discharge a liquid, through a photolithographic process, in the coating layer deposited on the solid layer; and removing the solid layer to form a flow path that communicates with the energy element and the discharge port. A material used for the coating layer contains a cationically polymerizable chemical compound, a cationic photopolymerization initiator and an inhibitor of cationic photopolymerization, and a material of the solid layer that forms a boundary with a portion where the discharge port of the coating layer is formed contains a copolymer of methacrylic acid and methacrylate ester.

Abstract: Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface.

Abstract: A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.

Abstract: A filter capable of separating or filtering micro foreign particles in a flow passage is provided. A first mask and a second mask are formed on a silicon substrate by dry etching. Before performing the dry etching, a resist of the first mask is subjected to a heat treatment performed at a temperature equal to or higher than a glass transition point. A resist of the second mask is not subjected to such a heat treatment. This processing simultaneously forms in the substrate a groove portion and a wall having a hole that is located in the groove portion. A silicon material located beneath a wide portion of the first mask remains as a wall portion separating the holes.

Abstract: A method for manufacturing a minute structure comprises a step of forming an ionizing radiation decomposing type positive type resist layer including a methyl isopropenyl ketone as a first positive type photosensitive material layer, a step of forming an ionizing radiation decomposing type positive type resist layer including a photosensitive material of a copolymer as a second positive type photosensitive material layer to be sensitized by an ionizing radiation of a second wavelength range on the first positive type photosensitive material layer, a step of forming a desired pattern in the above-mentioned second positive type photosensitive material layer, and development using a developing solution, and then, a step of forming a desired pattern in the above-mentioned first positive type photosensitive material layer to form a convex shape pattern.

Abstract: This invention relates to a manufacturing method of a liquid discharge head comprising: forming an active energy ray-curable resin layer on a surface of a substrate on which discharge energy generating elements are formed, attaching a material permeable to active energy rays onto a surface of the active energy ray-curable resin layer, pressing against the material permeable to active energy rays, a master mold being transparent to the active energy rays and having protrusions corresponding to a pattern of discharge ports so as to transfer the protrusions to the material permeable to active energy rays, selectively irradiating the active energy ray-curable resin layer with active energy rays according to a pattern of liquid flow paths so as to cure the active energy ray-curable resin layer, removing the master mold, and removing uncured portions of the active energy ray-curable resin layer.

Abstract: Provided is a method of producing an ink jet head including: providing the substrate which includes a through hole which forms the supply opening, and a layer that covers an opening of the through hole on a side of the one surface of the substrate; forming a protective film so that the protective film covers a side wall of the through hole and reaches the layer; depositing a photosensitive resin on the protective film; applying light from the side of the one surface of the substrate to pattern the photosensitive resin; and removing the protective film formed on a portion of the opening of the through hole on the side of the one surface of the substrate, with the patterned photosensitive resin being used as a mask.

Abstract: According to the fine pattern manufacturing method of the invention, the residue of a pattern which is obtained by pressing a mold is prevented from occurring, so that the structure can be more easily manufactured.

Abstract: A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from first surface to rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction the first surface; and forming a plurality of the supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

Abstract: An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.