Patents by Inventor Ryoji MATSUSHIIMA

Ryoji MATSUSHIIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE USING THE SAME
    Publication number: 20080197472
    Abstract: A semiconductor device includes a circuit board which has a first main surface having first connection pads, a second main surface having second connection pads, a first opening passing through a vicinity of the first connection pads, and a second opening passing through a vicinity of the second connection pads. A first semiconductor element is mounted in a face-down state on the first main surface of the circuit board. First electrode pads are exposed into the second opening and connected to the second connection pads through the second opening. A second semiconductor element is mounted in a face-up state on the second main surface of the circuit board. Second electrode pads are exposed into the first opening and connected to the first connection pads through the first opening.
    Type: Application
    Filed: February 15, 2008
    Publication date: August 21, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Ryoji MATSUSHIIMA