Abstract: A light emitting device includes a resin package having a recess defined by a recess bottom surface and a recess lateral surface. The resin package includes a first lead including a first lead lower surface, a first lead upper surface, and an end portion. The light emitting element is mounted on the first lead upper surface opposite to the first lead lower surface. The light reflecting member is disposed on the recess bottom surface between the recess lateral surface and the light emitting element in a lateral direction. The end portion is provided between the first lead lower surface and the light reflecting member in the lateral direction. The end portion has a cross-sectional area viewed in the lateral direction which is smaller than a cross-sectional area of the first lead between the first lead lower surface and the first lead upper surface viewed in the lateral direction.

Abstract: A method of manufacturing a plurality of light emitting devices includes providing a collective substrate including a plurality of packages, each of the packages including: a recess defined by lateral surfaces and a bottom surface, a first electrode and a second electrode that are disposed at the bottom surface of the recess, and a light-reflective first resin member surrounding an element-mounting region of the bottom surface of the recess, the first resin member having an upper surface located at a position higher than the element-mounting region; mounting a light emitting element in the element-mounting region; forming a light-reflective second resin member having a light reflective surface; and singulating the collective substrate to obtain the plurality of light emitting devices.

Abstract: A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.

Abstract: A light emitting device includes a base having a first lead electrode and a second lead electrode. Each of the first lead electrode and the second lead electrode includes a reflecting layer which includes silver or silver alloy plating containing a sulfur-based gloss agent. A light emitting element is provided on one side of the base and is electrically connected to the first lead electrode and the second lead electrode. The reflecting layer is on the one side of the base. A sealer includes resin and is provided on the one side of the base to seal the light emitting element and at least a part of the first lead electrode and the second lead electrode. A light-transmissive protective film includes an inorganic matter and is provided between the reflecting layer and the sealer.

Abstract: A package includes a resin molded body, a first lead electrode, a second lead electrode, and a recess portion. The recess portion is provided on a first side of the resin molded body and a light-emitting element is to be provided in the recess portion. The recess portion includes a bottom portion, a top portion, and a side wall. The bottom portion includes an element mount region and a wire connection region. An upper surface of the first lead electrode is exposed from the resin molded body in the element mount region and the element mount region has an outer peripheral shape in accordance with an outer peripheral shape of the light-emitting element when viewed in a height direction. The wire connection region is provided adjacent to the element mount region and is smaller than the element mount region.