Abstract: Disclosed is a method for manufacturing a fibroin solution including a step of forming a slurry containing a solvent-containing dissolving liquid and a fibroin-containing protein powder dispersed in the dissolving liquid by continuously introducing the protein powder to a thin film of the dissolving liquid while flowing the thin film; and a step of forming a fibroin solution by dissolving, in the dissolving liquid, the protein powder in the slurry.

Abstract: The present invention relates to a production method for a protein molded article, including: dissolving a protein in a solvent containing formic acid at a temperature of 40° C. or higher and lower than 80° C. to obtain a protein solution; and molding a protein molded article using the protein solution.

Abstract: The present invention relates to a method for recovering protein, which recovers a target protein from a mixture containing the target protein and a material different from the target protein, the method including a dissolution step of dissolving either the target protein or the material by applying pressure while heating to a solution for dissolution containing the mixture and a polar solvent, and a separation step of separating an obtained solution.

Abstract: An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.

Abstract: A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.

Abstract: A covered acceleration sensor element includes a support frame portion surrounding a weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion, and piezoresistance elements provided on the beam portions. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The plurality of inner frame support portions has flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis.

Abstract: A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.

Abstract: Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Abstract: A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

Abstract: A covered acceleration sensor element includes a weight portion, a support frame portion surrounding the weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion to support the weight portion, piezoresistance elements provided on the beam portions, and wirings for connecting them. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. Acceleration in the directions of three axes, i.e., a first axis in the joining thickness direction, a second axis in a plane perpendicular to the first axis, and a third axis in the plane and perpendicular to the second axis, or acceleration in the direction of any of the axes, is detected from changes in the resistances of the piezoresistance elements. The support frame portion is separated by separation grooves into an inner frame and an outer frame.

Abstract: An acceleration sensor whose characteristics including sensitivity are less likely to change relative to disturbance force applied to a sensor chip. The acceleration sensor has a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam. When disturbance force is applied to a sensor element in the direction in which the entire each of the beams extends, the stress damping sections absorbs the disturbance force.

Abstract: Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Abstract: A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

Abstract: An optical device wherein an optical component and a plurality of light emitting elements are mounted on an identical substrate, a level of a surface on which the optical component is mounted is different from that of a surface on which the light emitting elements are mounted by a step provided on the substrate, at least one plane vertical to the surface on which the optical component is mounted and located on a periphery of the substrate is opened, a reflecting surface, a transmitting surface or a diffraction grating surface of the optical component is provided along sides generated by the step provided in the substrate, optical axes of the plurality of light emitting elements of which polarization axes are in parallel with each other intersect with each other on the surface, and an exit light beam of the light emitting elements is emitted from the opened plane.

Abstract: Disclosed is a multi-range three-axis acceleration sensor device in which a plurality of three-axis acceleration sensor elements are formed without axial deviation among them in a single silicon chip and have different acceleration measurement ranges. Each of the plurality of sensor elements includes a weight, a frame surrounding the weight and flexible members composed of beams or diaphragm connecting the weight with the frame. Each of the plurality of sensor elements causes different output voltage for unit acceleration from another. A first three-axis acceleration sensor element among the plurality of sensor elements has other sensor elements of them formed in a frame of the first one and causes a larger output voltage for unit acceleration than the others.

Abstract: An optical switch for switching communication light beams propagating through a plurality of optical fibers. The switch includes a plurality of input-side lenses, a plurality of moving mirrors, a plurality of output-side lenses, light emitting units, and light receiving units arranged for optical communication. The plurality of input-side lenses include first input-side lenses to which communication light beams coming from first external units and propagating through input-side optical fibers connect optically and second input-side lenses to which the light beams from the light emitting units connect optically.

Abstract: A sensor structure using vibrating sensor elements which can detect an angular rate and accelerations in two axes at the same time is provided. 2 sets of vibration units which vibrate in out-of-phase mode (tunning-fork vibration) and include four vibrating sensor elements of the approximately same shape supported on a substrate in a vibratile state are provided and the vibrating sensor elements are disposed so that vibration axes of the vibration units cross each other at right angles. Each of the vibrating sensor elements includes a pair of detection units and adjustment units for adjusting a vibration frequency. The vibrating sensor elements constitute a combined sensor having supporting structure for supporting the vibrating sensor elements independently so that the vibrating sensor elements do not interfere with each other.

Abstract: A computer program embodied on a computer readable medium for designing a treating member contains a first code segment adapted to acquiring a piece of input information containing a treatment sequence; and a second code segment adapted to designing a flow path along which a sample moves, based on the piece of input information.

Abstract: An optical switch for switching communication light beams propagating through a plurality of optical fibers. The switch includes a plurality of input-side lenses, a plurality of moving mirrors, a plurality of output-side lenses, light emitting units, and light receiving units arranged for optical communication. The plurality of input-side lenses include first input-side lenses to which communication light beams coming from first external units and propagating through input-side optical fibers connect optically and second input-side lenses to which the light beams from the light emitting units connect optically.

Abstract: An optical device wherein an optical component and a plurality of light emitting elements are mounted on an identical substrate, a level of a surface on which the optical component is mounted is different from that of a surface on which the light emitting elements are mounted by a step provided on the substrate, at least one plane vertical to the surface on which the optical component is mounted and located on a periphery of the substrate is opened, a reflecting surface, a transmitting surface or a diffraction grating surface of the optical component is provided along sides generated by the step provided in the substrate, optical axes of the plurality of light emitting elements of which polarization axes are in parallel with each other intersect with each other on the surface, and an exit light beam of the light emitting elements is emitted from the opened plane.