Patents by Inventor Ryoji Okuda

Ryoji Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11347146
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: May 31, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Keika Hashimoto, Ryoji Okuda
  • Patent number: 11174350
    Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: November 16, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Yu Shoji, Kimio Isobe, Ryoji Okuda
  • Patent number: 10990008
    Abstract: The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: April 27, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Ryoji Okuda
  • Patent number: 10908500
    Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 2, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Kimio Isobe, Ryoji Okuda
  • Publication number: 20200362113
    Abstract: The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern. In order to achieve the above-described purpose, the configuration of the present invention is as follows. A resin composition which contains (P) a resin that has an alicyclic structure and an aromatic ring structure, and wherein the resin (P) that has an alicyclic structure and an aromatic ring structure has a group having two or more alicyclic rings and a group wherein two or more benzene rings are bonded by means of a single bond.
    Type: Application
    Filed: March 15, 2018
    Publication date: November 19, 2020
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yohei KIUCHI, Ryoji OKUDA
  • Patent number: 10584205
    Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 10, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Yutaro Koyama, Ryoji Okuda
  • Patent number: 10545406
    Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 28, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yu Shoji, Yuki Masuda, Kimio Isobe, Ryoji Okuda
  • Publication number: 20190256655
    Abstract: The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.
    Type: Application
    Filed: August 28, 2017
    Publication date: August 22, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Ryoji OKUDA
  • Publication number: 20190250511
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Application
    Filed: August 30, 2017
    Publication date: August 15, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Keika HASHIMOTO, Ryoji OKUDA
  • Patent number: 10365559
    Abstract: Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: July 30, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yukari Arimoto, Yuki Masuda, Ryoji Okuda
  • Publication number: 20190086800
    Abstract: The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
    Type: Application
    Filed: May 22, 2017
    Publication date: March 21, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Ryoji OKUDA
  • Publication number: 20190081258
    Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
    Type: Application
    Filed: September 21, 2016
    Publication date: March 14, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Yu SHOJI, Kimio ISOBE, Ryoji OKUDA
  • Patent number: 10197915
    Abstract: Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: February 5, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Yohei Kiuchi, Ryoji Okuda
  • Publication number: 20190033714
    Abstract: An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (Rb/Ra) between an alkali dissolution rate (Ra) of the resin (a) and an alkali dissolution rate (Rb) of the resin (b) satisfies a relationship of 0.5?Rb/Ra?2.0.
    Type: Application
    Filed: January 24, 2017
    Publication date: January 31, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Osamu BABA, Makoto HAYASAKA, Ryoji OKUDA
  • Publication number: 20190004423
    Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.
    Type: Application
    Filed: January 10, 2017
    Publication date: January 3, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yu SHOJI, Yuki MASUDA, Kimio ISOBE, Ryoji OKUDA
  • Publication number: 20180203353
    Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
    Type: Application
    Filed: September 20, 2016
    Publication date: July 19, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yu SHOJI, Yuki MASUDA, Kimio ISOBE, Ryoji OKUDA
  • Publication number: 20180066107
    Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
    Type: Application
    Filed: March 18, 2016
    Publication date: March 8, 2018
    Applicant: TORAY Industries, Inc.
    Inventors: Yu SHOJI, Yuki MASUDA, Yutaro KOYAMA, Ryoji OKUDA
  • Publication number: 20180051136
    Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2).
    Type: Application
    Filed: February 29, 2016
    Publication date: February 22, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yutaro KOYAMA, Ryoji OKUDA, Yuki MASUDA, Tomohiro KITAMURA, Yu SHOJI
  • Publication number: 20180031970
    Abstract: Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.
    Type: Application
    Filed: February 9, 2016
    Publication date: February 1, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yukari ARIMOTO, Yuki MASUDA, Ryoji OKUDA
  • Publication number: 20170327644
    Abstract: Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).
    Type: Application
    Filed: November 19, 2015
    Publication date: November 16, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Yohei KIUCHI, Ryoji OKUDA