Patents by Inventor Ryoji Setaka

Ryoji Setaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7131851
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: November 7, 2006
    Assignee: JSR Corporation
    Inventors: Ryoji Setaka, Terukazu Kokubo, Koji Seno, Takeo Hara
  • Patent number: 7095241
    Abstract: Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: August 22, 2006
    Assignee: JSR Corporation
    Inventors: Ryoji Setaka, Masaya Naoi, Katsumi Sato
  • Patent number: 7049836
    Abstract: Disclosed herein are an anisotropically conductive connector that conductivity of all conductive parts for connection is good, and insulating property between adjacent conductive parts for connection is surely achieved even when the pitch of electrodes as objects of connection is small, and good conductivity is retained over a long period of time even when it is used repeatedly under a high-temperature environment, and applications thereof.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: May 23, 2006
    Assignee: JSR Corporation
    Inventor: Ryoji Setaka
  • Publication number: 20060043983
    Abstract: Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed.
    Type: Application
    Filed: August 7, 2003
    Publication date: March 2, 2006
    Applicant: JSR COROPORATION
    Inventors: Ryoji Setaka, Masaya Naoi, Katsumi Sato
  • Publication number: 20050272282
    Abstract: Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them.
    Type: Application
    Filed: August 7, 2003
    Publication date: December 8, 2005
    Applicant: JSR CORPORATION
    Inventors: Ryoji Setaka, Terukazu Kokubo, Koji Seno, Takeo Hara
  • Publication number: 20050264307
    Abstract: Disclosed herein are an anisotropically conductive connector that conductivity of all conductive parts for connection is good, and insulating property between adjacent conductive parts for connection is surely achieved even when the pitch of electrodes as objects of connection is small, and good conductivity is retained over a long period of time even when it is used repeatedly under a high-temperature environment, and applications thereof.
    Type: Application
    Filed: August 7, 2003
    Publication date: December 1, 2005
    Applicant: JSR CORPORATION
    Inventor: Ryoji Setaka
  • Patent number: 6849335
    Abstract: Disclosed herein is an anisotropically conductive sheet capable of holding charge in its surfaces under an unpressurised state, and moving the charge held in the surface in a thickness-wise direction thereof in a state pressurised in the thickness-wise direction, thereby controlling the quantity of the charge at the surface. This anisotropically conductive sheet comprises a sheet base composed of an elastomer and conductive particles exhibiting magnetism contained in the sheet base in a state oriented so as to arrange in rows in a thickness-wise direction of the sheet base, and dispersed in a plane direction thereof. Supposing that a volume resistivity in the thickness-wise direction under an unpressurised state is R0, and a volume resistivity in the thickness-wise direction in a state pressurised under a pressure of 1 g/mm2 in the thickness-wise direction is R1, the volume resistivity R1 is 1×107 to 1×1012 ?·m, and a ratio (R0/R1) of the volume resistivity R0 to the volume resistivity R1 is 1×101 to 1×104.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: February 1, 2005
    Assignee: JSR Corporation
    Inventors: Hisao Igarashi, Kazuo Inoue, Ryoji Setaka
  • Publication number: 20040009343
    Abstract: Disclosed herein is an anisotropically conductive sheet capable of holding charge in its surfaces under an unpressurised state, and moving the charge held in the surface in a thickness-wise direction thereof in a state pressurised in the thickness-wise direction, thereby controlling the quantity of the charge at the surface.
    Type: Application
    Filed: January 16, 2003
    Publication date: January 15, 2004
    Inventors: Hisao Igarashi, Kazuo Inoue, Ryoji Setaka
  • Patent number: 6517744
    Abstract: A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.
    Type: Grant
    Filed: November 14, 2000
    Date of Patent: February 11, 2003
    Assignee: JSR Corporation
    Inventors: Takeo Hara, Shin-ichiro Iwanaga, Hozumi Sato, Ryoji Setaka