Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

Abstract: A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.

Abstract: A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.

Abstract: A printed wiring board includes a main wiring board having a main wiring pattern, and a sub wiring board mounted to the main board and having a sub wiring pattern such that the sub pattern electrically connects first and second electronic components, first conductor pads positioned to connect the first component to the main board and the sub board and having surfaces such that the first component is mounted onto the surfaces of the first pads via solder bumps, and second conductor pads positioned to connect the second component to the main board and the sub board and having surfaces such that the second component is mounted onto the surfaces of the second pads via solder bumps. The first and second pads are formed such that the surfaces of the first and second pads are formed on the same plane and have the same shape and the same size.

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity and having electrode terminals, an insulating layer formed on the substrate such that the insulating layer is covering the electronic component in the cavity, and via conductors formed through the insulating layer and including first via conductors and second via conductors such that the second via conductors are connected to the electrode terminals of the electronic component, respectively. The via conductors are formed in via formation holes penetrating through the insulating layer, respectively, and the via formation holes include first via formation holes and second via formation holes such that the second via formation holes are exposing the electrode terminals of the electronic component, respectively, and that a second via formation hole has a diameter which is smaller than a diameter of a first via formation hole.

Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

Abstract: A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.

Abstract: A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.

Abstract: A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.

Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

Abstract: A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.

Abstract: A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.

Abstract: A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.

Abstract: A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

Abstract: A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.