Patents by Inventor Ryoki Katoh

Ryoki Katoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4697204
    Abstract: A leadless chip carrier is constructed in such a manner that each of the electrode terminals is made to be recessed from the insulation layer of the bottom surface of the carrier so as to have a difference in level between the bottom surface and at least a part of the electrode terminal. Because of such construction, when the electrode terminals are bonded to the conductors of the printed circuit board in the reflowing method, molten solder is collected in the recessed portions of the electrode terminals besides each portion of the insulation layer positioned between the electrode terminals prevents flowing of the molten solder in the recessed portion, so that strength and reliability in the bonding are remarkably improved.
    Type: Grant
    Filed: July 22, 1983
    Date of Patent: September 29, 1987
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Tsunemasa Mita, Ryoki Katoh, Soichi Sekimoto, Yoshiyuki Shiratsuki, Hiroshi Arisawa