Abstract: A laser processing head comprises nozzle-holding means (5) for holding a nozzle in which a nozzle hole (11) is formed; condensing optical system-holding means (3) for holding a condensing optical system (2), the condensing optical system-holding means being slidably arranged in the nozzle-holding means while maintaining sealing, moving means (6) for slide-moving the nozzle-holding means and the condensing optical system-holding means relative to each other; gas-feeding means (13, 19) for feeding a gas into a laser processing head chamber (8) formed between the condensing optical system of the condensing optical system-holding means and the nozzle hole of the nozzle-holding means; passages (31) formed in the nozzle-holding means to communicate the laser processing head chamber with the exterior of the nozzle-holding means; slide members (33) that slide in the passages while maintaining sealing; and coupling means (35) for coupling the slide members to the condensing optical system-holding means.

Abstract: A laser apparatus (100) for performing the laser machining operation by condensing the laser light output from a laser oscillator (3) is disclosed. A laser output value calculation unit calculates a laser output value (L1) based on a command value (L0) issued to a laser oscillator (2). A temperature change estimating unit (31) estimates the temperature change or the temperature (Te) of specified component element(s) (7a, 7b) of the laser apparatus based on the elapsed time (t) and the laser output value calculated by the laser output value calculation unit. An adjusting unit (32) adjusts the conditions for controlling the laser or the conditions for laser machining based on the temperature change or the temperature of the specified component element estimated by the temperature change estimating unit. A stable laser machining operation is performed without a temperature sensor. The laser output value (L1) may be measured by a laser power sensor (5).

Abstract: A laser processing device (100) includes a laser oscillator (2), a laser machine (11) and a control means (1) for controlling the laser oscillator and the laser machine. The control means includes a storage means (50) for storing the processing program (60) for the work to be processed. The storage means has stored therein a required laser gas pressure value (72) for the laser oscillator in the laser processing operation, which value is determined in accordance with the processing specifics the work (20). The control means includes a laser gas pressure command transmission means (52) for transmitting a laser gas pressure command based on the required laser gas pressure value to the laser oscillator. This further improves the processing performance of the laser processing apparatus. Further, the control means may include a required laser gas pressure value adjusting means (55) for adjusting the required laser gas pressure value.

Abstract: A laser processing head comprises nozzle-holding means (5) for holding a nozzle in which a nozzle hole (11) is formed; condensing optical system-holding means (3) for holding a condensing optical system (2), the condensing optical system-holding means being slidably arranged in the nozzle-holding means while maintaining sealing, moving means (6) for slide-moving the nozzle-holding means and the condensing optical system-holding means relative to each other; gas-feeding means (13, 19) for feeding a gas into a laser processing head chamber. (8) formed between the condensing optical system of the condensing optical system-holding means and the nozzle hole of the nozzle-holding means; passages (31) formed in the nozzle-holding means to communicate the laser processing head chamber with the exterior of the nozzle-holding means; slide members (33) that slide in the passages while maintaining sealing; and coupling means (35) for coupling the slide members to the condensing optical system-holding means.

Abstract: A laser apparatus (100) for performing the laser machining operation by condensing the laser light output from a laser oscillator (3) is disclosed. A laser output value calculation unit calculates a laser output value (L1) based on a command value (L0) issued to a laser oscillator (2). A temperature change estimating unit (31) estimates the temperature change or the temperature (Te) of specified component element(s) (7a, 7b) of the laser apparatus based on the elapsed time (t) and the laser output value calculated by the laser output value calculation unit. An adjusting unit (32) adjusts the conditions for controlling the laser or the conditions for laser machining based on the temperature change or the temperature of the specified component element estimated by the temperature change estimating unit. A stable laser machining operation is performed without a temperature sensor. The laser output value (L1) may be measured by a laser power sensor (5).

Abstract: A laser machining system includes a laser oscillator (1) for outputting a laser beam, a light guide (2) through which the laser beam passes, a circulation guide (8) connected to the light guide (2), a filter (7) serving as a gas recycling means, and a fan (6) serving as a light guide blower means. The gas in the light guide (2) is sucked into the circulation guide (8) by the blower fan (6), so that molecules energized highly by being irradiated with the laser beam strike a filter material of the filter (7) provided in the circulation guide (8), thereby to restore the gas molecules to the ground state before irradiation and recycle it. The recycled gas is returned to the light guide (2). As gas molecules absorbing the energy of the laser beam and becoming large in effect of scattering of the laser beam is removed from the light guide (2), dispersion of the laser beam (3) can be suppressed and stable laser machining performance can be obtained.