Abstract: A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.

Abstract: A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.

Abstract: A method for manufacturing a piezoelectric oscillator. The method having the step of preparing a master substrate partitioned into plural substrate regions. Mounting on each of the substrate regions a piezoelectric vibrator and an IC for controlling an oscillation output of the piezoelectric vibrator. The master substrate is then divided into individual substrate regions by cutting the master substrate on the outside circumferences of the individual substrate regions, thereby obtaining a plurality of piezoelectric oscillators.

Abstract: An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10).

Abstract: An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10).

Abstract: A quartz-crystal oscillator has a configuration wherein a rectangular container 1 accommodating a piezoelectric oscillator device 5 therein is fixed to a rectangular supporting substrate 6 on which an IC device 7 is mounted via spacer members 12 formed of metal bodies. On the surface of the supporting substrate 6, part or all of the IC device 7 and side faces of the spacer members are coated with a resin material. When the quartz-crystal oscillator is implemented on a main board by soldering or the like, the problem that the solder for bonding the quartz-crystal oscillator to the main board is adhered to the spacer members 12, thereby causing a short-circuit can be effectively prevented.

Abstract: The temperature-compensated quartz-crystal oscillator comprises a quartz-crystal oscillation device, a package for accommodating the quartz-crystal oscillation device therein, an IC device for controlling an oscillation output based on oscillation of the quartz-crystal oscillation device, a substrate for attaching the package and mounting the IC device thereon, and a write control terminal for writing temperature compensation data into the IC device. The write control terminal is comprised of a metal body provided on the substrate.

Abstract: A quartz-crystal oscillator has a configuration wherein a rectangular container 1 accommodating a piezoelectric oscillator device 5 therein is fixed to a rectangular supporting substrate 6 on which an IC device 7 is mounted via spacer members 12 formed of metal bodies. On the surface of the supporting substrate 6, part or all of the IC device 7 and side faces of the spacer members are coated with a resin material. When the quartz-crystal oscillator is implemented on a main board by soldering or the like, the problem that the solder for bonding the quartz-crystal oscillator to the main board is adhered to the spacer members 12, thereby causing a short-circuit can be effectively prevented.

Abstract: A master substrate 15 is prepared which is partitioned into plural substrate regions A, formed with a window 16 in each of the substrate regions A, and provided with a throw-away region B between a respective pair of adjoining substrate regions A, the throw-away region including a write control terminal 12. A package 1 including a recess 11 is loaded from one side of the master substrate so as to be mounted on the substrate region A in a manner to close the window 16. A quartz-crystal oscillator device 5 is accommodated in the recess 11 of each package 1, while an aperture of the recess 11 is sealed with a closure 4. An IC 6 is inserted through the window 16 from the other side of the master substrate 15 so as to be mounted to a lower side of the package 1. Temperature compensation data for the quartz-crystal oscillator device 5 are written to a memory in the IC 6 via the write control terminal 12.

Abstract: An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10).

Abstract: An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10).