Patents by Inventor Ryosaku Wagatsuma

Ryosaku Wagatsuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130251972
    Abstract: To provide a flexible metal laminate plate obtained by pasting together an adhesive film, that suppresses the generation of dimensional variation, and a metal foil. (Resolution Means) A polyimide film having a manufacturing film width of 1 m or more; an anisotropy index (AI) expressed by formula 1 of 12 or less across the entire width, when the propagation speed V of an ultrasonic pulse is measured at an orientation angle (?) of the film of 45° and 135°, based on the machine conveyance direction (MD) of the film; and a thermoplastic polyimide layer with a thickness of 0.5 to 20 ?m provided on at least one surface.
    Type: Application
    Filed: March 25, 2013
    Publication date: September 26, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: NORIKO TOIDA, Ryosaku Wagatsuma, Satoshi Akiyama