Patents by Inventor Ryosuke Fukushima
Ryosuke Fukushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168688Abstract: A reservation management unit 24 acquires a joblog of a job that has been performed in a predetermined period, extracts as a specific job among jobs recorded in the joblog a job that the user is not a user having a predetermined relationship with the reservation user, derives a reservation timing on the basis of a time-wise distribution of the performing time point of the specific job, and performs a reservation of a print job of the reservation user to be performed at the derived reservation timing. Here, the user having a predetermined relationship with the reservation user is a user who belongs to a user group to which the reservation user belongs and the user group is a user group of users who work physically contiguously to each other.Type: ApplicationFiled: February 22, 2022Publication date: May 23, 2024Inventors: Ryosuke KATO, Keisuke FUKUSHIMA, Shigenaka KANEMITSU, Yasushi TSUKAMOTO, Akihiko IKAZAKI
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Publication number: 20240142558Abstract: Each of plural image forming apparatuses 2-1 to 2-N transmits a beacon signal including a device ID. Each of plural user terminal apparatuses 1-1 to 1-M determines a user ID of a user 101-i who currently uses it, receives the beacon signal transmitted from an image forming apparatus 2-j, and transmits to a mapping processing apparatus mapping information that associates the user ID and the device ID in the received beacon signal. Further, the mapping processing apparatus receives the mapping information on each user, determines a user associated by the mapping information with each image forming apparatus 2-j among the plural image forming apparatuses 2-1 to 2-M, and generates map data in which the determined user is associated with each image forming apparatus 2-j.Type: ApplicationFiled: February 22, 2022Publication date: May 2, 2024Inventors: Ryosuke KATO, Keisuke FUKUSHIMA, Shigenaka KANEMITSU, Yasushi TSUKAMOTO, Akihiko IKAZAKI
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Publication number: 20240114628Abstract: A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.Type: ApplicationFiled: September 20, 2023Publication date: April 4, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
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Publication number: 20240107683Abstract: A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.Type: ApplicationFiled: September 20, 2023Publication date: March 28, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
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Publication number: 20240107667Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.Type: ApplicationFiled: September 20, 2023Publication date: March 28, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
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Publication number: 20240107664Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.Type: ApplicationFiled: September 20, 2023Publication date: March 28, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
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Patent number: 5672874Abstract: An oil concentration meter includes a sample cell for receiving an oil sample that can be irradiated with infrared rays from a light source. A first interference filter having a design wavelength of 3.4 .mu.m is positioned before a measuring detector, while a second interference filter transmitting a band range between 1 .mu.m and 5 .mu.m is positioned in front of a reference detector. A logarithm of the ratio of the reference detector output to the measuring detector output is used for determining the oil concentration in a sample.Type: GrantFiled: March 30, 1995Date of Patent: September 30, 1997Assignee: Horiba, Ltd.Inventors: Hiroshi Fujii, Ryosuke Fukushima, Tatsuhide Tsutsui, Masahiko Ishida, Shuzi Takada
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Patent number: 5444379Abstract: An electric conductivity-measuring cell comprises a pressure container serving also as an outer electrode and provided with an inlet port of a liquid to be measured and an outlet port and an inner electrode provided within said pressure container so as to simplify it in construction and improve a measurement in accuracy.Type: GrantFiled: June 3, 1992Date of Patent: August 22, 1995Assignees: Horiba, Ltd., Nippon Sanso Corporation, Tadahiro OhmiInventors: Tadahiro Ohmi, Yoshio Ishihara, Ryosuke Fukushima
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Patent number: 5414361Abstract: A method capable of accurately and inexpensively measuring a very small quantity of impurities, such as water, contained in chemical substances, which are gaseous at normal temperature and pressure, is provided. A concentration of a very small quantity of impurities, contained in the chemical substances, which are gaseous at normal temperature and pressure, is measured by introducing the chemical substances into a cell under the condition of liquefied gases to measure an electric conductivity of the liquefied gases.Type: GrantFiled: June 5, 1992Date of Patent: May 9, 1995Assignees: Horiba, Ltd., Nippon Sanso Corporation, Tadahiro OhmiInventors: Tadahiro Ohmi, Yoshio Ishihara, Ryosuke Fukushima