Patents by Inventor Ryosuke HOSHINO

Ryosuke HOSHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220068564
    Abstract: An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 3, 2022
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Junichi SHINOZAKI, Toshiki KONDO, Ryosuke HOSHINO, Takahisa FUKUDA
  • Publication number: 20210375550
    Abstract: An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kiyoshiro YATAGAWA, Satoshi KOBAYASHI, Ryosuke HOSHINO
  • Publication number: 20210304967
    Abstract: A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 30, 2021
    Inventors: Ryosuke HOSHINO, Satoshi KOBAYASHI, Yasuaki UCHIDA, Satsuki FUJII