Patents by Inventor Ryosuke KADO

Ryosuke KADO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12707600
    Abstract: An electric component module includes a substrate including a first metal foil provided on a first surface, and a second metal foil provided on a second surface and in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided, a heat generating component disposed away from the substrate, a heat transfer resin that has contact with the substrate and the heat generating component, a metal member that is disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate, a heat dissipation member that has contact with the substrate and the metal member, and a heat transfer pin to be inserted into the via hole. A part of the heat transfer pin has contact with the heat transfer resin.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: August 11, 2026
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ryosuke Kado, Keiichiro Shizu
  • Publication number: 20250056766
    Abstract: An electric component module includes a substrate including a first metal foil provided on a first surface, and a second metal foil provided on a second surface and in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided, a heat generating component disposed away from the substrate, a heat transfer resin that has contact with the substrate and the heat generating component, a metal member that is disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate, a heat dissipation member that has contact with the substrate and the metal member, and a heat transfer pin to be inserted into the via hole. A part of the heat transfer pin has contact with the heat transfer resin.
    Type: Application
    Filed: February 16, 2022
    Publication date: February 13, 2025
    Inventors: Ryosuke KADO, Keiichiro SHIZU