Patents by Inventor Ryosuke KONDO

Ryosuke KONDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8550947
    Abstract: A speed change device configured with an input member and an output member. The speed change device includes a speed change mechanism in which a plurality of shift speeds are established in accordance with respective engagement states of a plurality of friction engagement elements to transfer rotation of the input member to the output member. A slip travel mode is provided in which the vehicle is run while transferring torque from the input member to the output member with one of the friction engagement elements for establishment of each of the shift speeds caused to slip. A slip engagement element is the friction engagement element to be engaged commonly for establishment of at least a forward start shift speed and a reverse start shift speed.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: October 8, 2013
    Assignee: Aisin AW Co., Ltd.
    Inventors: Satoru Kasuya, Masashi Kitou, Yuichi Seki, Yusuke Takahashi, Ryosuke Kondo
  • Publication number: 20130213043
    Abstract: A hybrid drive device having an engine coupling shaft member, a speed change mechanism, a rotating electrical machine, and an engine connecting clutch. A first lubricating oil passage scatters lubricating oil from radially inside to radially outside of first and second friction plates. A first one-way clutch is interposed between an engine coupling shaft member and a coupling member, and is configured to not be engaged when rotation of the engine coupling shaft member becomes lower than rotation of the coupling member. A second one-way clutch is configured not to be engaged when rotation of the rotating electrical machine becomes lower than rotation of the coupling member. An engine driven oil pump generates an oil pressure to be supplied by a driving force of the internal combustion engine or a driving force of the rotating electrical machine regardless of engagement or disengagement of the engine connecting clutch.
    Type: Application
    Filed: April 24, 2013
    Publication date: August 22, 2013
    Inventors: Satoru Kasuya, Masashi Kito, Yuichi Seki, Ryosuke Kondo, Osamu Murai
  • Publication number: 20120211322
    Abstract: A friction-plate lubricating device for an automatic transmission that includes a friction engagement element with a plurality of friction plates in which outer friction plates and inner friction plates are alternately disposed; a hub with splines engaged with teeth formed on an inner circumference of the inner friction plates, the hub having the splines on an outer circumference thereof and having uneven portions formed on an inner circumference thereof; and a nozzle that discharges lubricant to the uneven portions. Recesses of the uneven portions serve as oil reservoirs in which the lubricant gathers, and through-holes are formed in bottom surfaces of the recesses. The lubricant discharged from the nozzle is collected in the oil reservoirs formed by the recesses so as to be supplied to the plurality of friction plates of the friction engagement element through the through-holes.
    Type: Application
    Filed: January 19, 2012
    Publication date: August 23, 2012
    Applicant: AISIN AW CO., LTD.
    Inventors: Satoru KASUYA, Masashi KITO, Yuichi SEKI, Ryosuke KONDO
  • Publication number: 20120088621
    Abstract: A speed change device configured with an input member and an output member. The speed change device includes a speed change mechanism in which a plurality of shift speeds are established in accordance with respective engagement states of a plurality of friction engagement elements to transfer rotation of the input member to the output member. A slip travel mode is provided in which the vehicle is run while transferring torque from the input member to the output member with one of the friction engagement elements for establishment of each of the shift speeds caused to slip. A slip engagement element is the friction engagement element to be engaged commonly for establishment of at least a forward start shift speed and a reverse start shift speed.
    Type: Application
    Filed: September 20, 2011
    Publication date: April 12, 2012
    Applicant: AISIN AW CO., LTD.
    Inventors: Satoru Kasuya, Masashi Kitou, Yuichi Seki, Yusuke Takahashi, Ryosuke Kondo
  • Publication number: 20110278602
    Abstract: A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.
    Type: Application
    Filed: May 10, 2011
    Publication date: November 17, 2011
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventor: Ryosuke KONDO
  • Publication number: 20100123162
    Abstract: An optical semiconductor apparatus can be configured by mounting an optical semiconductor element on a package substrate using a solder paste. The optical semiconductor apparatus can include a package substrate and a metal die pad formed on the substrate, and an optical semiconductor element bonded to the die pad with a solder material. The substrate can be made of a ceramic base material. A plurality of through holes can be formed in the substrate so that the through holes penetrate both the substrate base material and the die pad. Each of the through holes can have an inner surface where the ceramic base material is exposed. Each through hole can have an opening diameter greater than or equal to 40 ?m and less than or equal to 100 ?m. The plurality of through holes can be formed such that the total area of the openings of the through holes is 50% or less of the bonded area between the optical semiconductor element and the die pad including the through holes covered with the solder material.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 20, 2010
    Inventors: Ryosuke Kondo, Takaaki Sakai
  • Publication number: 20090302342
    Abstract: A semiconductor light-emitting device and a method for manufacturing the same can include a mixture resin encapsulating an LED chip in order to emit various colored lights, and can also include a separate transparent resin. The semiconductor light-emitting device can include a supporting plate, a base board located on the supporting plate, an upper base board located on the base board via an insulating adhesive layer, and an LED chip mounted on the supporting plate and located in a cavity composed of through-bores in the base boards. The transparent resin can be disposed circularly around an end of the insulating adhesive layer so as not to generate bubbles therein. The mixture resin can be disposed in the cavity except for that portion in which the transparent resin is located. Thus, the device can be configured to easily detect bubbles with a visual examination even if/when the bubbles are caused in the transparent resin. The disclosed device and method can prevent defective products from going to market.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 10, 2009
    Inventors: Ryosuke KONDO, Mika MOCHIZUKI