Abstract: A fixing device includes: a first rotatable member; a second rotatable member disposed in contact with the first rotatable member; a pressing member that is disposed along an inner circumferential surface of the second rotatable member and presses the inner circumferential surface of the second rotatable member such that the second rotatable member is pressed against the first rotatable member; a sliding member interposed between the inner circumferential surface of the second rotatable member and the pressing member; and a lubricant interposed between the inner circumferential surface of the second rotatable member and the sliding member. The sliding member has an irregular sliding surface having a surface roughness Ra1 of 0.20 ?m or more and a material ratio Rmr of 35% or more.

Abstract: A film includes a fluorine-free material and has a peel strength (kPa) from a fixed resin of (A) at 25° C. and (B) at 200° C. satisfying that (A) is 0 kPa or more and 20 kPa or less and (B?A) is 10 kPa or less.

Abstract: An intermediate transfer belt includes a resin, conductive carbon particles, and an alkyl silicone oil and a modified body thereof, in which regions different in a content of the alkyl silicone oil and the modified body thereof are formed on an outer peripheral surface, in a case where a silicon amount (Atomic %) on the outer peripheral surface is measured along an axial direction using an X-ray photoelectron spectroscopy, the silicon amount is periodically increased and decreased along the axial direction, and a peak-to-peak distance in an increasing/decreasing period of the silicon amount is 0.1 mm or more and 5.0 mm or less.

Abstract: A tubular fixing member includes a first layer and a second layer that is disposed in contact with an outer circumferential side of the first layer. In a case where thermal conductivities of the first layer in an axial direction, a circumferential direction, and a thickness direction are denoted by ?1x, ?1y, and ?1z, respectively, and thermal conductivities of the second layer in the axial direction, the circumferential direction, and the thickness direction are denoted by ?2x, ?2y, and ?2z, respectively, the following requirements (1), (2), and (3) are satisfied.

Abstract: An array device manufacturing method includes the steps of forming a plurality of optical elements on a wafer; inspecting the plurality of optical elements; defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection; and forming the array device by dicing the wafer along the dicing lines.

Abstract: A tubular body for a fixing member includes: a first layer having a thermal conductivity of 1.0 W/m·K or more; and a second layer containing a resin and particles of a solid material in which heat absorption/release associated with electronic phase transition occurs.

Abstract: A tubular fixing member includes a first layer and a second layer that is disposed in contact with an outer circumferential side of the first layer. In a case where thermal conductivities of the first layer in an axial direction, a circumferential direction, and a thickness direction are denoted by ?1x, ?1y, and ?1z, respectively, and thermal conductivities of the second layer in the axial direction, the circumferential direction, and the thickness direction are denoted by ?2x, ?2y, and ?2z, respectively, the following requirements (1), (2), and (3) are satisfied.

Abstract: A tubular body for a fixing member includes: a first layer having a thermal conductivity of 1.0 W/m·K or more; and a second layer containing a resin and particles of a solid material in which heat absorption/release associated with electronic phase transition occurs.

Abstract: A polymer material molded product includes a polymer material and a porous carbon material having an X-ray diffraction spectral characteristic shown in the following (1) or (2), (1): a peak derived from a (002) plane of carbon is observed, a half width of the peak derived from the (002) plane of carbon is 5° or more, and a half width of a peak derived from a (10) plane of carbon is 3.2° or less, and (2): the peak derived from the (002) plane of carbon is not observed, and the half width of the peak derived from the (10) plane of carbon is 3.2° or less.

Abstract: A polymer material molded product includes a polymer material and a porous carbon material having an X-ray diffraction spectral characteristic shown in the following (1) or (2), (1): a peak derived from a (002) plane of carbon is observed, a half width of the peak derived from the (002) plane of carbon is 5° or more, and a half width of a peak derived from a (10) plane of carbon is 3.2° or less, and (2): the peak derived from the (002) plane of carbon is not observed, and the half width of the peak derived from the (10) plane of carbon is 3.2° or less.

Abstract: In a method of manufacturing surface-emitting lasers, a substrate having a major surface including a plurality of areas each provided with a plurality of surface-emitting lasers is prepared. A first laser beam emitted when a direct-current voltage is applied to each of an n number of surface-emitting lasers among the plurality of surface-emitting lasers is measured, n being an integer of 2 or greater. A second laser beam emitted when an alternating-current voltage is applied to each of an m number of surface-emitting lasers among the plurality of surface-emitting lasers is measured, m being a natural number smaller than n. Whether the n number of surface-emitting lasers are each conforming or defective is determined from a result of the measurement of the first laser beam. Whether the m number of surface-emitting lasers are each conforming or defective is determined from a result of the measurement of the second laser beam.

Abstract: In a method of manufacturing surface-emitting lasers, a substrate having a major surface including a plurality of areas each provided with a plurality of surface-emitting lasers is prepared. A first laser beam emitted when a direct-current voltage is applied to each of an n number of surface-emitting lasers among the plurality of surface-emitting lasers is measured, n being an integer of 2 or greater. A second laser beam emitted when an alternating-current voltage is applied to each of an m number of surface-emitting lasers among the plurality of surface-emitting lasers is measured, m being a natural number smaller than n. Whether the n number of surface-emitting lasers are each conforming or defective is determined from a result of the measurement of the first laser beam. Whether the m number of surface-emitting lasers are each conforming or defective is determined from a result of the measurement of the second laser beam.

Abstract: A light-emitting module includes a substrate, a first surface-emitting laser mounted on the substrate, the first surface-emitting laser having a first engaging portion protruded outward at an end, and a second surface-emitting laser mounted on the substrate, the second surface-emitting laser having a second engaging portion recessed inward at an end. The first surface-emitting laser and the second surface-emitting laser are adjacent to each other. The first engaging portion and the second engaging portion are engaged with each other.

Abstract: A vertical cavity surface emitting laser according to an aspect of the present disclosure includes a substrate having a main surface including a III-V group compound semiconductor and a semiconductor structure having a post disposed on the main surface. The main surface has an off-angle greater than 2° with respect to a plane. The post includes an active layer and a current confinement layer that are arranged in a first direction intersecting the main surface. The current confinement layer includes an aperture portion and an insulation portion surrounding the aperture portion. The current confinement layer has a uniaxially symmetric shape or an asymmetric shape in a section perpendicular to the first direction.

Abstract: An array device manufacturing method includes the steps of forming a plurality of optical elements on a wafer; inspecting the plurality of optical elements; defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection; and forming the array device by dicing the wafer along the dicing lines.

Abstract: A measurement method of a surface-emitting laser includes a step of causing a surface-emitting laser to emit light and a step of positioning an optical axis of an optical system on each of a plurality of positions of the surface-emitting laser and measuring a spectrum at each of the plurality of positions.

Abstract: A surface-emitting laser measuring method includes the steps of causing at least one surface-emitting laser to emit light; and measuring a light intensity and a spectrum of the at least one surface-emitting laser by splitting the light emitted from the at least one surface-emitting laser in the step of causing the at least one surface-emitting laser to emit light and causing one split beam to be incident on a light-intensity measuring unit while causing another split beam to be incident on a spectrum measuring unit.

Abstract: A light-emitting module includes a substrate, a first surface-emitting laser mounted on the substrate, the first surface-emitting laser having a first engaging portion protruded outward at an end, and a second surface-emitting laser mounted on the substrate, the second surface-emitting laser having a second engaging portion recessed inward at an end. The first surface-emitting laser and the second surface-emitting laser are adjacent to each other. The first engaging portion and the second engaging portion are engaged with each other.

Abstract: Electrophoresis device including: a first flow passage extending in a first direction and through which a sample and a buffer solution flow; a sample collecting part provided at an end portion of the first flow passage and configured to collect the sample; electrodes disposed at both sides of the first flow passage in a second direction perpendicular to the first direction and configured to apply a voltage to the first flow passage in the second direction; second flow passages communicating with both sides of the first flow passage in the second direction, configured to accommodate the electrodes, and through which a second buffer solution flows; and partition walls fixed to communicating portions between the first and second flow passages with a predetermined bonding strength and configured to block movement of substances between the first and second flow passages. The partition walls are formed of a gel material having ion permeability.

Abstract: A method of fabricating a surface-emitting laser includes the steps of fabricating a substrate product including device sections, a pad electrode, and a conductor, each of the device sections including a surface-emitting laser having an electrode, the conductor connecting the pad electrode to the electrode across a boundary of the device sections; attaching a connection device to the substrate product, the connection device including a probe device having a probe and a probe support base having an opening; performing a burn-in test of the surface-emitting lasers by applying electric power to the pad electrode through the probe at a high temperature; and after the burn-in test, separating the substrate product into semiconductor chips. The burn-in test includes a step of monitoring light emitted by the surface-emitting laser through the opening during the burn-in test, and a step of selecting the surface-emitting lasers based on a monitoring result.