Abstract: A module is provided with a structural object and a connection member. The structural object is provided with an electronic device and a resin portion. The electronic device has an electrode. The electronic device is embedded in the resin portion. The electrode is exposed from the resin portion. The connection member is provided with a film-like base member, an adhesive layer 34 provided on the film-like base member and a wiring formed on the adhesive layer at least in part. The connection member is stuck to the structural object. At least a part of the resin portion of the structural object is directly stuck to the adhesive layer of the connection member. The wiring is pressed to the electrode of the electronic device.

Abstract: In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.

Abstract: In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: A module is provided with a structural object and a connection member. The structural object is provided with an electronic device and a resin portion. The electronic device has an electrode. The electronic device is embedded in the resin portion. The electrode is exposed from the resin portion. The connection member is provided with a film-like base member, an adhesive layer 34 provided on the film-like base member and a wiring formed on the adhesive layer at least in part. The connection member is stuck to the structural object. At least a part of the resin portion of the structural object is directly stuck to the adhesive layer of the connection member. The wiring is pressed to the electrode of the electronic device.

Abstract: In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Abstract: In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.

Abstract: A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.

Abstract: There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Abstract: A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.

Abstract: There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Abstract: There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Abstract: There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.