Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.

Abstract: A method for producing a wiring circuit board includes a region setting step of setting a pattern forming region and an opening forming region in a support layer; an insulating layer forming step of forming a base insulating layer on the support layer in the pattern forming region; a pattern step of forming a conductive pattern having a first conductive layer and a second conductive layer on the base insulating layer; and an etching step of etching the support layer in the opening forming region, and in the pattern step, a dummy pattern is formed in the opening forming region.

Abstract: A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.

Abstract: A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

Abstract: A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.

Abstract: Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.

Abstract: Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

Abstract: Provided is a method for producing a wiring circuit board capable of improving the dimensional accuracy of a second conductive layer. The wiring circuit board produced by the producing method includes a metal supporting layer, a first insulating layer disposed on one surface of the metal supporting layer in a thickness direction, a first conductive layer disposed on one surface of the first insulating layer in the thickness direction, a second insulating layer disposed on one surface of the first insulating layer in the thickness direction so as to cover the first conductive layer, and a second conductive layer disposed on one surface of the second insulating layer in the thickness direction. The producing method includes a step of forming the second insulating layer by bonding a film made of a photosensitive resin to one surfaces of the first insulating layer and the first conductive layer in the thickness direction.

Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.