Patents by Inventor Ryosuke Takada

Ryosuke Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12036776
    Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: July 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Kamitsubo, Tsuyoshi Katsube, Ryosuke Takada
  • Publication number: 20240206060
    Abstract: A resin sheet that contains one or more kinds of resin materials and a liquid crystal polymer, wherein a weight of the liquid crystal polymer is less than a total weight of the one or more kinds of resin materials. The resin sheet has a thermal expansion coefficient in a plane direction smaller than a thermal expansion coefficient in the plane direction of a comparative resin sheet containing the one or more kinds of resin materials and not containing the liquid crystal polymer.
    Type: Application
    Filed: February 26, 2024
    Publication date: June 20, 2024
    Inventors: Ryosuke TAKADA, Michiharu NISHIMURA
  • Publication number: 20240182607
    Abstract: An electro-optic polymer includes a backbone that is a polynorbornene chain and an electro-optic structure at a side chain on the backbone. The polynorbornene chain has a first constituent unit represented by: wherein at least one of X1 or X2 is a binding site between the polynorbornene chain and the electro-optic structure, when X1 is the binding site, X2 is —O— or —NH—, when X2 is the binding site, X1 is a hydrogen atom or substituted or unsubstituted alkyl group, and nA2 is an integer of 1 or greater.
    Type: Application
    Filed: January 18, 2024
    Publication date: June 6, 2024
    Inventor: Ryosuke TAKADA
  • Patent number: 11659652
    Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: May 23, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ryosuke Takada
  • Patent number: 11558958
    Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: January 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Kamitsubo, Tsuyoshi Katsube, Ryosuke Takada
  • Publication number: 20220377886
    Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Yusuke KAMITSUBO, Tsuyoshi KATSUBE, Ryosuke TAKADA
  • Patent number: 11510315
    Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: November 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromasa Koyama, Ryosuke Takada, Atsushi Kasuya
  • Patent number: 11445606
    Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: September 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Kamitsubo, Tsuyoshi Katsube, Ryosuke Takada
  • Publication number: 20220153943
    Abstract: A resin sheet that contains one or more kinds of resin materials and a liquid crystal polymer, wherein a weight of the liquid crystal polymer is less than a total weight of the one or more kinds of resin materials. The resin sheet has a thermal expansion coefficient in a plane direction smaller than a thermal expansion coefficient in the plane direction of a comparative resin sheet containing the one or more kinds of resin materials and not containing the liquid crystal polymer.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Inventors: Ryosuke TAKADA, Michiharu NISHIMURA
  • Publication number: 20220151066
    Abstract: A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.
    Type: Application
    Filed: January 26, 2022
    Publication date: May 12, 2022
    Inventors: Ryosuke TAKADA, Michiharu NISHIMURA
  • Patent number: 11266016
    Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: March 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Kamitsubo, Ryosuke Takada, Tsuyoshi Katsube, Yasuhiro Kuratani, Shigeru Tago, Tomohiro Furumura
  • Patent number: 11257779
    Abstract: A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: February 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryosuke Takada, Toshitaka Hayashi, Hiromasa Koyama
  • Publication number: 20210345487
    Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
    Type: Application
    Filed: July 7, 2021
    Publication date: November 4, 2021
    Inventors: Hiromasa KOYAMA, Ryosuke TAKADA, Atsushi KASUYA
  • Publication number: 20210283890
    Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Inventors: Yusuke KAMITSUBO, Tsuyoshi KATSUBE, Ryosuke TAKADA
  • Publication number: 20210267045
    Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventor: Ryosuke TAKADA
  • Publication number: 20210267051
    Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.
    Type: Application
    Filed: May 13, 2021
    Publication date: August 26, 2021
    Inventors: Yusuke KAMITSUBO, Ryosuke TAKADA, Tsuyoshi KATSUBE, Yasuhiro KURATANI, Shigeru TAGO, Tomohiro FURUMURA
  • Patent number: 11089680
    Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: August 10, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromasa Koyama, Ryosuke Takada, Atsushi Kasuya
  • Publication number: 20210212203
    Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Inventors: Yusuke KAMITSUBO, Tsuyoshi KATSUBE, Ryosuke TAKADA
  • Patent number: 11001042
    Abstract: A method of manufacturing a treated sheet includes preparing a resin layer composite including a resin sheet and a thermoplastic resin layer supported on one surface of the resin sheet, applying a dispersion liquid including a powdery thermoplastic resin raw material onto a surface of the thermoplastic resin layer opposite to the resin sheet, and fusing the thermoplastic resin raw material to the thermoplastic resin layer by irradiating, with light from a flash lamp, a coating of the thermoplastic resin raw material formed in the applying step. The thermoplastic resin raw material has a melting point higher than the glass transition point of a resin that is a primary material of the resin sheet.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: May 11, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryosuke Takada, Hiroyuki Ohata
  • Patent number: 10959327
    Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: March 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichi Araki, Hideyuki Taguchi, Hayato Noma, Ryosuke Takada