Abstract: A multilayer varistor according to the present disclosure includes; a sintered compact; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes a thinner region having a smaller thickness than a surrounding region that surrounds the thinner region.

Abstract: A multilayer varistor according to the present disclosure includes: a sintered compact having, on a surface thereof, at least one planar portion and at least one corner portion; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the at least one planar portion and the at least one corner portion of the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes: a first high-resistivity layer covering the at least one planar portion; and a second high-resistivity layer covering the at least one corner portion. The first high-resistivity layer has a larger average thickness than the second high-resistivity layer.

Abstract: A multilayer varistor of the present disclosure includes a sintered body, a first internal electrode, a second internal electrode, a first external electrode, a second external electrode, and a high-resistance layer. The first internal electrode and the second internal electrode are disposed in the sintered body. The first external electrode is disposed on a surface of the sintered body and is electrically connected to the first internal electrode. The second external electrode is disposed on the surface of the sintered body and is electrically connected to the second internal electrode. The high-resistance layer covers at least part of the surface of the sintered body, and the high-resistance layer has a surface having a plurality of cracks.

Abstract: A liquid immersion cooling device includes an electronic device and a cooling medium. The electronic device includes a circuit board, a heat generator mounted on the circuit board, a heat dissipator, and a thermal conductive sheet interposed between the heat generator and the heat dissipator. The cooling medium is arranged to immerse the electronic device at least partially. At least part of the thermal conductive sheet is made of a porous material.

Abstract: Provided is a thermal insulator which can be prevented from having gaps. The thermal insulator includes a nonwoven fabric, and xerogel in interior spaces of the nonwoven fabric. The thermal insulator has a plurality of protrusions on a surface of the thermal insulator, a height of the protrusion ranges from 0.10 t to 0.25 t inclusive and a size of the protrusion at the surface of the thermal insulator ranges from t to 5 t inclusive, where t is a thickness of the thermal insulator, and pores are provided inside the thermal insulator in a region provided with the protrusions.

Abstract: A multilayer varistor according to the present disclosure includes: a sintered compact having, on a surface thereof, at least one planar portion and at least one corner portion; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the at least one planar portion and the at least one corner portion of the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes: a first high-resistivity layer covering the at least one planar portion; and a second high-resistivity layer covering the at least one corner portion. The first high-resistivity layer has a larger average thickness than the second high-resistivity layer.

Abstract: A multilayer varistor according to the present disclosure includes; a sintered compact; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes a thinner region having a smaller thickness than a surrounding region that surrounds the thinner region.

Abstract: A multilayer varistor includes: a sintered compact; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the sintered compact at least partially and containing element Si; and an external electrode arranged to cover the high-resistivity layer partially, electrically connected to the internal electrode, and containing silver as a main component thereof. A ratio of a total mass of the alkali metals and the alkaline earth metals to a mass of the element Si in a surface region of the high-resistivity layer is equal to or less than 0.6.

Abstract: A multilayer varistor of the present disclosure includes a sintered body, a first internal electrode, a second internal electrode, a first external electrode, a second external electrode, and a high-resistance layer. The first internal electrode and the second internal electrode are disposed in the sintered body. The first external electrode is disposed on a surface of the sintered body and is electrically connected to the first internal electrode. The second external electrode is disposed on the surface of the sintered body and is electrically connected to the second internal electrode. The high-resistance layer covers at least part of the surface of the sintered body, and the high-resistance layer has a surface having a plurality of cracks.

Abstract: A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

Abstract: A reactor device includes a coil, a magnetic core having the coil thereon, a case accommodating the coil and the magnetic core, a cooling plate fixed to the case, an insulating sheet disposed between the coil and the cooling plate, a compressible graphite sheet disposed between the coil and the cooling plate, and a screw to fix the cooling plate to the case. The case has a screw hole and an opening provided therein. The screw passes through the screw hole to fix the cooling plate to the case. The coil contacts the insulating sheet through the opening of the case. The graphite sheet contacts the cooling plate. The reactor has high cooling performance and reliability.

Abstract: A sintered body that includes ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

Abstract: A heat insulation sheet includes a fiber sheet having spaces therein and a silica xerogel held in the spaces of the fiber sheet. The heat insulation sheet includes a thick region and a low compressible region thinner than the thick region. A compressibility of the low compressible region is equal to smaller than 5% upon having a pressure of 0.7 MPa applied to the low compressible region. This heat insulation sheet is superior in electrical insulation properties and thermal insulation properties, and secures a predetermined distance even in a case that the heat insulation sheet receives pressures from the both sides thereof, thus providing equipment with reliability.

Abstract: A fiber sheet having first and second surfaces and spaces therein is prepared. The spaces of the fiber sheet are impregnated with silica sol containing water glass and ethylene carbonate. Silica gel is formed by causing the silica sol with which the spaces of the fiber sheet is impregnated to gel while a difference between respective temperatures at the first and surfaces of the fiber sheet is equal to or larger than 50° C. The silica gel is hydrophobized, thereby providing a thermal insulation sheet. In the thermal insulation sheet, compressibilities of the first and second surfaces for a predetermined pressure applied thereto are different from each other. The thermal insulation sheet may be disposed between two battery cells so as to prevent one sell from influencing the other even if the one expands.

Abstract: A reactor device includes a coil, a magnetic core having the coil thereon, a case accommodating the coil and the magnetic core, a cooling plate fixed to the case, an insulating sheet disposed between the coil and the cooling plate, a compressible graphite sheet disposed between the coil and the cooling plate, and a screw to fix the cooling plate to the case. The case has a screw hole and an opening provided therein. The screw passes through the screw hole to fix the cooling plate to the case. The coil contacts the insulating sheet through the opening of the case. The graphite sheet contacts the cooling plate. The reactor has high cooling performance and reliability.

Abstract: Provided is a thermal insulator which can be prevented from having gaps. The thermal insulator includes a nonwoven fabric, and xerogel in interior spaces of the nonwoven fabric. The thermal insulator has a plurality of protrusions on a surface of the thermal insulator, a height of the protrusion ranges from 0.10t to 0.25t inclusive and a size of the protrusion at the surface of the thermal insulator ranges from t to 5t inclusive, where t is a thickness of the thermal insulator, and pores are provided inside the thermal insulator in a region provided with the protrusions.

Abstract: A highly reliable electronic device that efficiently dissipates generated heat and a method for manufacturing the electronic device are provided. The electronic device includes mount board, heat generating component mounted on mount board, pressing component provided above heat generating component, and film provided between heat generating component and pressing component. Further, liquid heat conductive material is provided between heat generating component and film and between pressing component and graphite-based carbonaceous film. Film contains graphite-based carbon and is compressed to predetermined compressibility by pressing component.

Abstract: An object of the present invention is to provide a thermal insulator which is easily position-adjusted when disposed in equipment. A plurality of projections are provided on at least one surface of thermal insulator including nonwoven fabric and xerogel in interior spaces of nonwoven fabric. With this configuration, fine positioning or the like is easily performed when thermal insulator is disposed, and a thickness increases by a height of projections, so that a thermal insulation effect can be improved. Thus, the thermal insulator can be used for thermal insulation of various types of equipment.

Abstract: A heat insulation sheet includes a fiber sheet having spaces therein and a silica xerogel held in the spaces of the fiber sheet. The heat insulation sheet includes a thick region and a low compressible region thinner than the thick region. A compressibility of the low compressible region is equal to smaller than 5% upon having a pressure of 0.7 MPa applied to the low compressible region. This heat insulation sheet is superior in electrical insulation properties and thermal insulation properties, and secures a predetermined distance even in a case that the heat insulation sheet receives pressures from the both sides thereof, thus providing equipment with reliability.

Abstract: A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.