Abstract: A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths. The red phosphor material is included in a phosphor sheet, and the phosphor sheet is disposed on a surface of the light-guide plate.

Abstract: A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths. The red phosphor material is included in a phosphor sheet, and the phosphor sheet is disposed on a surface of the light-guide plate.

Abstract: A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.

Abstract: A light source device includes an electronic component and a substrate. The electronic component includes first and second electrodes exposed at a lower surface. The first electrode includes first and second parts separated from each other by a separation region on the lower surface of the electronic component. The substrate includes a basal member and a first and second wiring layers disposed on an upper surface of the basal member. The electronic component is mounted to the substrate so that upper surfaces of the first and second wiring layers respectively face the first and second electrodes. The substrate includes a first region at a position overlapping the separation region as seen in a top view. Solder wettability of the substrate in the first region is lower than solder wettability of the substrate in at least regions of the first wiring layer facing the first and second parts of the first electrode.

Abstract: A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths. The red phosphor material is included in a phosphor sheet, and the phosphor sheet is disposed on a surface of the light-guide plate.

Abstract: A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths.

Abstract: A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.

Abstract: A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.

Abstract: A light emitting device mounting structural body includes a wiring substrate having wirings disposed on a base member and a light emitting device having a resin molded body mounted on the wiring substrate. The wiring substrate has a recess in its periphery. The resin molded body has a lower surface and a side surface. The lower surface has an arrangement portion and a projecting portion, the arrangement portion has an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion is projected further downward relative to the arrangement portion. The side surface has an opening with a light emitting element mounted thereon, the opening is expanded in the projecting portion, and at least a portion of the opening is housed in the recess of the wiring substrate.

Abstract: A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.

Abstract: A backlight unit has a light-guide plate and a light source optically coupled with the light-guide plate, with which light is input from a plane of the light-guide plate and white-light is output from the first principal plane of the light-guide plate. The light source has a plurality of blue light emitting diodes, red phosphor material excited by light from the blue light emitting diodes and emits red light, and a plurality of green semiconductor lasers having emission peaks at green light wavelengths.

Abstract: A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.

Abstract: A light emitting device mounting structural body includes a wiring substrate having wirings disposed on a base member and a light emitting device having a resin molded body mounted on the wiring substrate. The wiring substrate has a recess in its periphery. The resin molded body has a lower surface and a side surface. The lower surface has an arrangement portion and a projecting portion, the arrangement portion has an outer lead electrically connected to the wiring portion disposed beneath the arrangement portion, and the projecting portion is projected further downward relative to the arrangement portion. The side surface has an opening with a light emitting element mounted thereon, the opening is expanded in the projecting portion, and at least a portion of the opening is housed in the recess of the wiring substrate.

Abstract: A backlight unit includes a lower frame comprising an opening; a light source arranged in the opening; a light guide plate arranged in the opening; and an upper frame arranged above the lower frame. The unit is so arranged that if one side of a projection (e.g., in the upper frame) is made in contact with one side of a hole (e.g. in the lower frame), then the first side end portion on the first overall end of the side surface of the upper frame is located approximately in the same plane with a first side end portion on the first overall end of the side surface of the lower frame, and the second side end portion on the second overall end of the side surface of the upper frame extends beyond the second side end portion on the second overall end of the side surface of the lower frame.

Abstract: A backlight unit includes a light source, a light guide guiding light from the light source, an optical sheet disposed on the light guide, and an inner frame having an opening housing the optical sheet. A peripheral portion of the optical sheet includes a projection group respectively at each of the longitudinal sides that are among the constituent sides of an approximately rectangular external contour of the optical sheet. The projection group includes a first projection arranged in a projection insertion region provided in a side wall of the inner frame and a second projection arranged outside of the projection insertion region in the opening of the inner frame.

Abstract: Problems to be Solved Provided is a backlight unit capable of maintaining its outermost size of the plane even when a horizontal misalignment occurs in the fixation of the upper frame and the lower frame during assembling or transportation. Solution: A backlight unit includes a lower frame defining an opening portion in its upper portion, a light source arranged in the opening portion, a light guide plate arranged in the opening portion for guiding light from the light source, and an upper frame arranged at the opening portion side of the opening portion and having a window portion capable of transmitting light from the light guide plate. The lower frame and the upper frame are engagingly fixed at an engaging portion having a projecting portion integrally arranged on a side surface of one side surface and a rib portion defining a hole portion extending from an another side surface to the one side surface and to which the projecting portion can be engaged with.

Abstract: An electrically illuminating indicator needle and a light guiding member therefor that allow such a control as length of the needle can be varied while undergoing less unevenness in luminance and can be manufactured at a lower cost are provided. The electrically illuminating indicator needle comprises a plurality of planes of incidence, a plurality of light reflecting surfaces disposed to correspond to the planes of incidence so as to reflect light coming from the planes of incidence, a light guiding member disposed to correspond to the light reflecting surfaces so as to cause the light reflected on the light reflecting surfaces to emerge, and a plurality of light emitting diodes disposed to oppose the planes of incidence.

Abstract: A backlight unit includes a light source, a light guide guiding light from the light source, an optical sheet disposed on the light guide, and an inner frame having an opening housing the optical sheet. A peripheral portion of the optical sheet includes a projection group respectively at each of the longitudinal sides that are among the constituent sides of an approximately rectangular external contour of the optical sheet. The projection group includes a first projection arranged in a projection insertion region provided in a side wall of the inner frame and a second projection arranged outside of the projection insertion region in the opening of the inner frame.

Abstract: An electrically illuminating indicator needle and a light guiding member therefor that allow such a control as length of the needle can be varied while undergoing less unevenness in luminance and can be manufactured at a lower cost are provided. The electrically illuminating indicator needle comprises a plurality of planes of incidence, a plurality of light reflecting surfaces disposed to correspond to the planes of incidence so as to reflect light coming from the planes of incidence, a light guiding member disposed to correspond to the light reflecting surfaces so as to cause the light reflected on the light reflecting surfaces to emerge, and a plurality of light emitting diodes disposed to oppose the planes of incidence.

Abstract: A light emitting apparatus includes a light guiding member that projects light, incident on an end face thereof, through a principal plane; and a plurality of light emitting diodes that are optically coupled with the end face. The light guiding member has a protruding surface formed in part of the end face thereof and comprises a first light introducing portion that is formed on the protruding surface and is optically coupled to a first light emitting diode, and a second light introducing portion that is optically coupled to a second light emitting diode and is formed on the rest of the end face. The first and second light emitting diodes are capable of emitting color-blended light having two or more peaks in the spectrum.