Abstract: A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.

Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Abstract: A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

Abstract: An electronic component module includes a first substrate, a coupling electrode and a second substrate. The coupling electrode is provided on a first surface of the first substrate, the coupling electrode is configured to be electromagnetically coupled with a conductor pattern on an antenna member. The second substrate is provided on the first surface of the first substrate, the second substrate covers the coupling electrode. A first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

Abstract: A wireless communication device is provided that includes an RFIC module having an RFIC chip and first and second terminal electrodes connected to the RFIC chip. An antenna member is provided that includes an antenna pattern having first and second coupling portions and an antenna base material on which the antenna pattern is disposed. Moreover, an insulating sticky layer is disposed between the RFIC module and the antenna member, and is provided for bonding the RFIC module to the antenna member. The first terminal electrode and the first coupling portion are capacitively coupled, with the sticky layer in between, and the second terminal electrode and the second coupling portion are capacitively coupled, with the sticky layer in between.

Abstract: An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Abstract: A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.

Abstract: A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

Abstract: A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.

Abstract: An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

Abstract: A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.

Abstract: A wireless communication device is provided that includes an RFIC module having an RFIC chip and first and second terminal electrodes connected to the RFIC chip. An antenna member is provided that includes an antenna pattern having first and second coupling portions and an antenna base material on which the antenna pattern is disposed. Moreover, an insulating sticky layer is disposed between the RFIC module and the antenna member, and is provided for bonding the RFIC module to the antenna member. The first terminal electrode and the first coupling portion are capacitively coupled, with the sticky layer in between, and the second terminal electrode and the second coupling portion are capacitively coupled, with the sticky layer in between.

Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.