Patents by Inventor Ryosuke YANAKA
Ryosuke YANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12576622Abstract: An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.Type: GrantFiled: December 14, 2021Date of Patent: March 17, 2026Assignee: DENKA COMPANY LIMITEDInventors: Takeshi Saito, Ikuka Inoda, Ryosuke Yanaka
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Patent number: 12154818Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.Type: GrantFiled: March 8, 2021Date of Patent: November 26, 2024Assignee: DENKA COMPANY LIMITEDInventors: Yuko Fukuda, Junpei Fujiwara, Ryosuke Yanaka
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Patent number: 12119255Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.Type: GrantFiled: March 8, 2021Date of Patent: October 15, 2024Assignee: DENKA COMPANY LIMITEDInventors: Yuko Fukuda, Junpei Fujiwara, Ryosuke Yanaka
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Publication number: 20240317475Abstract: An electronic device packaging sheet provided with a substrate sheet in which a substrate layer A and a substrate layer B are alternately laminated, wherein: the thickness of an individual substrate layer A is 10-60 ?m; the thickness of an individual substrate layer B is 1-50 ?m; the average value of the thickness of an individual substrate layer A is greater than the average value of the thickness of an individual substrate layer B; and the substrate layer A and the substrate layer B include a different thermoplastic resin as a main component.Type: ApplicationFiled: December 14, 2021Publication date: September 26, 2024Applicant: DENKA COMPANY LIMITEDInventors: Ikuka INODA, Takeshi SAITO, Ryosuke YANAKA
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Publication number: 20240309158Abstract: A resin sheet for electronic component packaging with transparency, excellent folding endurance, and also excellent low-temperature heat sealing property, and an electronic component packaging container using the resin sheet. A resin sheet for electronic component packaging, the resin sheet composed of a rubber-modified aromatic vinyl-based copolymer resin that includes rubber-type polymers (Y) as dispersed particles in a continuous matrix resin (X), and that satisfies (1) and (2): (1) the continuous matrix resin (X) is a copolymer of 53-63 mass % of one or more aromatic vinyl-based compounds (x1) and 37-47 mass % of one or more (meth)acrylic acid alkyl esters (x2); and (2) the ratio of the rubber-type polymers (Y) to the total mass of the rubber-modified aromatic vinyl-based copolymer resin is 5 mass % or more and less than 10 mass %.Type: ApplicationFiled: February 1, 2022Publication date: September 19, 2024Applicant: DENKA COMPANY LIMITEDInventors: Ikuka INODA, Ryosuke YANAKA, Takeshi SAITO
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Publication number: 20240059053Abstract: An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.Type: ApplicationFiled: December 14, 2021Publication date: February 22, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takeshi SAITO, Ikuka INODA, Ryosuke YANAKA
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Publication number: 20240010806Abstract: A resin sheet for molding includes a base material sheet, and a surface layer provided on at least one surface of the base material sheet and including silicone, wherein the silicone content in the surface layer is 0.3 to 4.0 g/m2, and wherein the base material sheet is formed of a resin composition including 29 to 65 parts by mass of a Styrene-conjugated diene block copolymer (A), 25 to 60 parts by mass of a polystyrene resin (B), and 8 to 20 parts by mass of a high-impact polystyrene resin (C) (provided that a total amount of the component (A), the component (B), and the component (C) is 100 parts by mass). A carrier tape 100 is a molded body 16 of the resin sheet, wherein an accommodation portion 20 capable of accommodating an article is provided.Type: ApplicationFiled: June 7, 2021Publication date: January 11, 2024Applicant: Denka Company LimitedInventors: Takeshi SAITO, Ryosuke YANAKA
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Publication number: 20230279190Abstract: A resin sheet is for molding, has an impact strength of 1.0 J or greater in a DuPont impact test, and has a value of 80 N/m2 or smaller obtained through integration from an origin point to a strain when fracture has occurred in a stress strain curve obtained in a tensile test. A carrier tape 100 is a molded body 16 of the resin sheet, wherein an accommodation portions 20 capable of accommodating an article is provided.Type: ApplicationFiled: June 7, 2021Publication date: September 7, 2023Applicant: Denka Company LimitedInventors: Ryosuke YANAKA, Takeshi SAITO, Kota SAWAGUCHI
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Patent number: 11701874Abstract: A layered sheet has a substrate layer and surface layers provided on both surfaces of the substrate layer, wherein the surface layers contain 50 to 90 mass % of component (A) defined below and 10 to 50 mass % of component (B) defined below relative to the overall mass of the surface layer; the substrate layer is composed of a vinyl aromatic hydrocarbon resin composition containing monomer units derived from conjugated dienes; and a percentage of the monomer units derived from the conjugated dienes in the substrate layer is 6 to 14 mass % relative to all monomer units in the vinyl aromatic hydrocarbon-based resin composition. Component (A) is a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer in which the percentage of a conjugated diene rubber component is 5 to 25 mass %. Component (B) is a polymeric antistatic agent.Type: GrantFiled: April 16, 2020Date of Patent: July 18, 2023Assignee: DENKA COMPANY LIMITEDInventors: Ryosuke Yanaka, Junpei Fujiwara
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Publication number: 20230084488Abstract: A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.Type: ApplicationFiled: March 8, 2021Publication date: March 16, 2023Applicant: DENKA COMPANY LIMITEDInventors: Yuko FUKUDA, Junpei FUJIWARA, Ryosuke YANAKA
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Publication number: 20220194067Abstract: A layered sheet has a substrate layer and surface layers provided on both surfaces of the substrate layer, wherein the surface layers contain 50 to 90 mass % of component (A) defined below and 10 to 50 mass % of component (B) defined below relative to the overall mass of the surface layer; the substrate layer is composed of a vinyl aromatic hydrocarbon resin composition containing monomer units derived from conjugated dienes; and a percentage of the monomer units derived from the conjugated dienes in the substrate layer is 6 to 14 mass % relative to all monomer units in the vinyl aromatic hydrocarbon-based resin composition. Component (A) is a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer in which the percentage of a conjugated diene rubber component is 5 to 25 mass %. Component (B) is a polymeric antistatic agent.Type: ApplicationFiled: April 16, 2020Publication date: June 23, 2022Applicant: DENKA COMPANY LIMITEDInventors: Ryosuke YANAKA, Junpei FUJIWARA
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Patent number: 11292233Abstract: A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.Type: GrantFiled: January 23, 2019Date of Patent: April 5, 2022Assignee: DENKA COMPANY LIMITEDInventors: Ryosuke Yanaka, Yusuke Masuda
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Publication number: 20210162721Abstract: A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.Type: ApplicationFiled: January 23, 2019Publication date: June 3, 2021Applicant: DENKA COMPANY LIMITEDInventors: Ryosuke YANAKA, Yusuke MASUDA