Abstract: A press-fitting direction position of a pressing surface of a pressing portion of a press-fitting tool and a press-fitting direction position of a restriction surface of a restriction portion of the press-fitting tool are set so that one of a press-fitting component and a press-fitting target component is stopped at a prescribed press-fitting stop position.

Abstract: A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.

Abstract: A press-fitting apparatus includes: a support portion and a pressing mechanism having a press-fitting tool configured to move in a press-fitting direction with respect to the support portion. The press-fitting tool includes: a pressing portion having a pressing surface which presses a press-fitting component; a restriction portion having a restriction surface configured to come into contact with a press-fitting target component; and a position setting mechanism which sets a press-fitting position of the pressing surface in the press-fitting direction and a restriction position of the restriction surface in the press-fitting direction according to the press-fitting component and the press-fitting target component.

Abstract: A press-fitting apparatus includes: a support portion and a pressing mechanism having a press-fitting tool configured to move in a press-fitting direction with respect to the support portion. The press-fitting tool includes: a pressing portion having a pressing surface which presses a press-fitting component; a restriction portion having a restriction surface configured to come into contact with a press-fitting target component; and a position setting mechanism which sets a press-fitting position of the pressing surface in the press-fitting direction and a restriction position of the restriction surface in the press-fitting direction according to the press-fitting component and the press-fitting target component.

Abstract: A press-fitting direction position of a pressing surface of a pressing portion of a press-fitting tool and a press-fitting direction position of a restriction surface of a restriction portion of the press-fitting tool are set so that one of a press-fitting component and a press-fitting target component is stopped at a prescribed press-fitting stop position.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.

Abstract: A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

Abstract: A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

Abstract: A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

Abstract: An apparatus for detecting component attachment of the present invention includes a detection head for detecting presence or absence of a component or whether or not a component is attached, and a driving mechanism for driving the detection head in an attachment direction of the component. The detection head includes a movable element having a distal end portion capable of being brought into contact with a predetermined portion of the component, a guide passage for guiding the movable element in the attachment direction so as to be capable of reciprocal motion, a fluid passage for passing a fluid when the distal end portion is brought into contact with the predetermined portion and pushed and the movable element is moved to a predetermined position, and a detection portion for detecting a pressure or a flow rate of the fluid flowing through the fluid passage.

Abstract: An apparatus for detecting component attachment of the present invention includes a detection head (70) for detecting presence or absence of a component or whether or not a component is attached, and a driving mechanism (80) for driving the detection head in an attachment direction of the component. The detection head (70) includes a movable element (72) having a distal end portion capable of being brought into contact with a predetermined portion of the component, a guide passage (71c) for guiding the movable element in the attachment direction so as to be capable of reciprocal motion, a fluid passage (71d) for passing a fluid when the distal end portion is brought into contact with the predetermined portion and pushed and the movable element is moved to a predetermined position, and a detection portion for detecting a pressure or a flow rate of the fluid flowing through the fluid passage.