Abstract: A tampering detection device includes tampering detection circuitry configured to acquire an access pattern of a monitoring target file, extract a time-series pattern of access for each monitoring target file from the access pattern acquired, and determine a scan pattern on a basis of the time-series pattern of access extracted.

Abstract: A liquid discharge head including: a flow path formation part in which pressure generation chambers are arranged; and a pressure generation unit configured to apply pressure to the pressure generation chambers, wherein the pressure generation unit is formed by joining a vibration unit to the flow path formation part with a resin layer, and wherein the resin layer includes a curable resin composition including (A) an epoxy resin, (B) a polythiol compound, (C) at least one adhesiveness-imparting agent selected from the group consisting of a compound represented by General Formula (1), a titanium compound represented by General Formula (2-1), and a titanium compound represented by General Formula (2-2), and (D) a curing accelerator.

Abstract: A liquid discharge head including: a flow path formation part in which pressure generation chambers are arranged; and a pressure generation unit configured to apply pressure to the pressure generation chambers, wherein the pressure generation unit is formed by joining a vibration unit to the flow path formation part with a resin layer, and wherein the resin layer includes a curable resin composition including (A) an epoxy resin, (B) a polythiol compound, (C) at least one adhesiveness-imparting agent selected from the group consisting of a compound represented by General Formula (1), a titanium compound represented by General Formula (2-1), and a titanium compound represented by General Formula (2-2), and (D) a curing accelerator.

Abstract: A silicon-containing curing composition including a specific amount of a silicon-containing polymer having an Mw of 300 to 100,000 obtained by hydrolysis and condensation of an organosilane mixture containing specific amounts of organosiloxanes of formulae (1-1) through (1-5); a specific amount of a prepolymer containing at least two Si—H groups per molecule obtained by hydrosilylation between a cyclic siloxane compound of formula (2) and a compound of formula (3-1), (3-2), or (3-3); a specific amount of a linear siloxane compound containing more than one carbon-carbon double bond reactive with Si—H or Si—CH3 per molecule; specific amounts of an organic peroxide and a metal catalyst; and a specific amount of a filler. The details for the formulae (1-1) to (1-5), (2), (3-1) to (3-3) are as described in the specification.

Abstract: A silicon-containing curing composition including a specific amount of a silicon-containing polymer having an Mw of 300 to 100,000 obtained by hydrolysis and condensation of an organosilane mixture containing specific amounts of organosiloxanes of formulae (1-1) through (1-5); a specific amount of a prepolymer containing at least two Si—H groups per molecule obtained by hydrosilylation between a cyclic siloxane compound of formula (2) and a compound of formula (3-1), (3-2), or (3-3); a specific amount of a linear siloxane compound containing more than one carbon-carbon double bond reactive with Si—H or Si—CH3 per molecule; specific amounts of an organic peroxide and a metal catalyst; and a specific amount of a filler. The details for the formulae (1-1) to (1-5), (2), (3-1) to (3-3) are as described in the specification.

Abstract: A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Abstract: A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Abstract: An alkali-developable photosensitive color composition containing a binder resin, a fluorine-containing copolymer, a photopolymerization initiator, a colorant, and a solvent. A photopolymerizable unsaturated compound is used as the binder resin. The photopolymerizable unsaturated compound is obtained by adding (B) an unsaturated monobasic acid to (A) a polyfunctional epoxy resin to form (C) an epoxy adduct and allowing the epoxy adduct (C) and (D) a polybasic acid anhydride to react with each other.

Abstract: An alkali-developable photosensitive color composition containing a binder resin, a fluorine-containing copolymer, a photopolymerization initiator, a colorant, and a solvent. A photopolymerizable unsaturated compound is used as the binder resin. The photopolymerizable unsaturated compound is obtained by adding (B) an unsaturated monobasic acid to (A) a polyfunctional epoxy resin to form (C) an epoxy adduct and allowing the epoxy adduct (C) and (D) a polybasic acid anhydride to react with each other.