Abstract: A coupling/uncoupling device includes a columnar member configured by a divided pair of semicircular members, and a pair of coupling members forming a circular holding section that holds the columnar member. The circular holding section includes a circular inner surface section with which an outer circumferential surface of the columnar member is in slide contact, the circular inner surface section being formed from inner circumferential surfaces of a semicircular section in one coupling member and a semicircular section in the other coupling member. The columnar member is configured to be rotatable in both clockwise and counterclockwise directions along the circular inner surface section about a reference position where a contact surface of the pair of coupling members and a dividing surface of the columnar member are flush with each other.

Abstract: A coupling/uncoupling device includes a columnar member configured by a divided pair of semicircular members, and a pair of coupling members forming a circular holding section that holds the columnar member. The circular holding section includes a circular inner surface section with which an outer circumferential surface of the columnar member is in slide contact, the circular inner surface section being formed from inner circumferential surfaces of a semicircular section in one coupling member and a semicircular section in the other coupling member. The columnar member is configured to be rotatable in both clockwise and counterclockwise directions along the circular inner surface section about a reference position where a contact surface of the pair of coupling members and a dividing surface of the columnar member are flush with each other.

Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.

Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.